Intel N50 vs AMD Ryzen Embedded R1600
Comparative analysis of Intel N50 and AMD Ryzen Embedded R1600 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel N50
- CPU is newer: launch date 2 year(s) 10 month(s) later
- Around 10% higher clock speed: 3.4 GHz vs 3.1 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
- 2.5x lower typical power consumption: 6 Watt vs 15 Watt
- Around 1% better performance in PassMark - Single thread mark: 1790 vs 1779
Specifications (specs) | |
Launch date | 3 Jan 2023 vs 25 Feb 2020 |
Maximum frequency | 3.4 GHz vs 3.1 GHz |
Manufacturing process technology | 10 nm vs 14 nm |
Thermal Design Power (TDP) | 6 Watt vs 15 Watt |
Benchmarks | |
PassMark - Single thread mark | 1790 vs 1779 |
Reasons to consider the AMD Ryzen Embedded R1600
- 2 more threads: 4 vs 2
- 524288x more L2 cache, more data can be stored in the L2 cache for quick access later
- 699050.7x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 16% better performance in PassMark - CPU mark: 3365 vs 2907
Specifications (specs) | |
Number of threads | 4 vs 2 |
L2 cache | 1 MB vs 2MB (shared) |
L3 cache | 4 MB vs 6MB (shared) |
Benchmarks | |
PassMark - CPU mark | 3365 vs 2907 |
Compare benchmarks
CPU 1: Intel N50
CPU 2: AMD Ryzen Embedded R1600
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel N50 | AMD Ryzen Embedded R1600 |
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PassMark - Single thread mark | 1790 | 1779 |
PassMark - CPU mark | 2907 | 3365 |
Compare specifications (specs)
Intel N50 | AMD Ryzen Embedded R1600 | |
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Essentials |
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Launch date | 3 Jan 2023 | 25 Feb 2020 |
Place in performance rating | 1460 | 1461 |
Architecture codename | Zen | |
Vertical segment | Mobile | |
Performance |
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Base frequency | 1000 MHz | 2.6 GHz |
L1 cache | 96K (per core) | 192 KB |
L2 cache | 2MB (shared) | 1 MB |
L3 cache | 6MB (shared) | 4 MB |
Manufacturing process technology | 10 nm | 14 nm |
Maximum core temperature | 105°C | 105 °C |
Maximum frequency | 3.4 GHz | 3.1 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 4 |
Unlocked | ||
Die size | 209.8 mm² | |
Transistor count | 4950 million | |
Memory |
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ECC memory support | ||
Supported memory types | DDR4, DDR5, 4800 MHz, Single-channel | DDR4-2400 |
Max memory channels | 2 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | Intel BGA 1264 | |
Thermal Design Power (TDP) | 6 Watt | 15 Watt |
Configurable TDP-down | 12 Watt | |
Configurable TDP-up | 25 Watt | |
Socket Count | FP5 | |
Peripherals |
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PCIe configurations | Gen 3, 9 Lanes, (CPU only) | |
Max number of PCIe lanes | 8 | |
PCI Express revision | 3.0 |