Intel N50 vs AMD Ryzen Embedded R1600

Comparative analysis of Intel N50 and AMD Ryzen Embedded R1600 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel N50

  • CPU is newer: launch date 2 year(s) 10 month(s) later
  • Around 10% higher clock speed: 3.4 GHz vs 3.1 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
  • 2.5x lower typical power consumption: 6 Watt vs 15 Watt
  • Around 1% better performance in PassMark - Single thread mark: 1790 vs 1779
Specifications (specs)
Launch date 3 Jan 2023 vs 25 Feb 2020
Maximum frequency 3.4 GHz vs 3.1 GHz
Manufacturing process technology 10 nm vs 14 nm
Thermal Design Power (TDP) 6 Watt vs 15 Watt
Benchmarks
PassMark - Single thread mark 1790 vs 1779

Reasons to consider the AMD Ryzen Embedded R1600

  • 2 more threads: 4 vs 2
  • 524288x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 699050.7x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 16% better performance in PassMark - CPU mark: 3365 vs 2907
Specifications (specs)
Number of threads 4 vs 2
L2 cache 1 MB vs 2MB (shared)
L3 cache 4 MB vs 6MB (shared)
Benchmarks
PassMark - CPU mark 3365 vs 2907

Compare benchmarks

CPU 1: Intel N50
CPU 2: AMD Ryzen Embedded R1600

PassMark - Single thread mark
CPU 1
CPU 2
1790
1779
PassMark - CPU mark
CPU 1
CPU 2
2907
3365
Name Intel N50 AMD Ryzen Embedded R1600
PassMark - Single thread mark 1790 1779
PassMark - CPU mark 2907 3365

Compare specifications (specs)

Intel N50 AMD Ryzen Embedded R1600

Essentials

Launch date 3 Jan 2023 25 Feb 2020
Place in performance rating 1459 1460
Architecture codename Zen
Vertical segment Mobile

Performance

Base frequency 1000 MHz 2.6 GHz
L1 cache 96K (per core) 192 KB
L2 cache 2MB (shared) 1 MB
L3 cache 6MB (shared) 4 MB
Manufacturing process technology 10 nm 14 nm
Maximum core temperature 105°C 105 °C
Maximum frequency 3.4 GHz 3.1 GHz
Number of cores 2 2
Number of threads 2 4
Unlocked
Die size 209.8 mm²
Transistor count 4950 million

Memory

ECC memory support
Supported memory types DDR4, DDR5, 4800 MHz, Single-channel DDR4-2400
Max memory channels 2

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported Intel BGA 1264
Thermal Design Power (TDP) 6 Watt 15 Watt
Configurable TDP-down 12 Watt
Configurable TDP-up 25 Watt
Socket Count FP5

Peripherals

PCIe configurations Gen 3, 9 Lanes, (CPU only)
Max number of PCIe lanes 8
PCI Express revision 3.0