Intel Pentium 350 vs Intel Pentium 967

Comparative analysis of Intel Pentium 350 and Intel Pentium 967 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Graphics, Graphics interfaces, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Pentium 350

Intel Pentium 967

Differences

Reasons to consider the Intel Pentium 350

CPU is newer: launch date 1 month(s) later
Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
Around 13% lower typical power consumption: 15 Watt vs 17 Watt

Launch date	November 2011 vs 1 October 2011
L3 cache	3072 KB (shared) vs 2 MB
Thermal Design Power (TDP)	15 Watt vs 17 Watt

Reasons to consider the Intel Pentium 967

Around 8% higher clock speed: 1.3 GHz vs 1.2 GHz

Maximum frequency	1.3 GHz vs 1.2 GHz

Compare benchmarks

CPU 1: Intel Pentium 350
CPU 2: Intel Pentium 967

Name	Intel Pentium 350	Intel Pentium 967
PassMark - Single thread mark		616
PassMark - CPU mark		643
Geekbench 4 - Single Core		1227
Geekbench 4 - Multi-Core		1904

Compare specifications (specs)

	Intel Pentium 350	Intel Pentium 967
Essentials
Architecture codename	Sandy Bridge	Sandy Bridge
Launch date	November 2011	1 October 2011
Place in performance rating	not rated	2325
Vertical segment	Server	Mobile
Processor Number		967
Series		Legacy Intel® Pentium® Processor
Status		Launched
Performance
64 bit support
Die size	131 mm	131 mm
L1 cache	64 KB (per core)	128 KB
L2 cache	256 KB (per core)	512 KB
L3 cache	3072 KB (shared)	2 MB
Manufacturing process technology	32 nm	32 nm
Maximum frequency	1.2 GHz	1.3 GHz
Number of cores	2	2
Transistor count	504 million	504 million
Base frequency		1.30 GHz
Bus Speed		5 GT/s DMI
Maximum core temperature		100 °C
Number of threads		2
Memory
Supported memory types	DDR3	DDR3 1066/1333
Max memory channels		2
Maximum memory bandwidth		21.3 GB/s
Maximum memory size		16 GB
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	1155	BGA1023
Thermal Design Power (TDP)	15 Watt	17 Watt
Low Halogen Options Available
Package Size		31.0mm x 24.0mm (BGA1023)
Graphics
Graphics base frequency		350 MHz
Graphics max dynamic frequency		1.00 GHz
Graphics max frequency		1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel HD Graphics
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported		2
SDVO
Wireless Display (WiDi) support
Peripherals
Max number of PCIe lanes		16
PCI Express revision		2.0
PCIe configurations		1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)