Intel Pentium 977 vs Intel Celeron Dual-Core T1700

Comparative analysis of Intel Pentium 977 and Intel Celeron Dual-Core T1700 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Pentium 977

Intel Celeron Dual-Core T1700

Differences

Reasons to consider the Intel Pentium 977

CPU is newer: launch date 3 year(s) 3 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
2.1x lower typical power consumption: 17 Watt vs 35 Watt
Around 9% better performance in PassMark - CPU mark: 1148 vs 1058

Specifications (specs)
Launch date	1 April 2012 vs 7 December 2008
Manufacturing process technology	32 nm vs 65 nm
Thermal Design Power (TDP)	17 Watt vs 35 Watt
Benchmarks
PassMark - CPU mark	1148 vs 1058

Reasons to consider the Intel Celeron Dual-Core T1700

Around 31% higher clock speed: 1.83 GHz vs 1.4 GHz
2x more L2 cache, more data can be stored in the L2 cache for quick access later

Maximum frequency	1.83 GHz vs 1.4 GHz
L2 cache	1024 KB vs 512 KB

Compare benchmarks

CPU 1: Intel Pentium 977
CPU 2: Intel Celeron Dual-Core T1700

PassMark - CPU mark

CPU 1

CPU 2

1148

1058

Name	Intel Pentium 977	Intel Celeron Dual-Core T1700
PassMark - Single thread mark	0	0
PassMark - CPU mark	1148	1058

Compare specifications (specs)

	Intel Pentium 977	Intel Celeron Dual-Core T1700
Essentials
Architecture codename	Sandy Bridge	Merom
Launch date	1 April 2012	7 December 2008
Place in performance rating	3331	3332
Processor Number	977	T1700
Series	Legacy Intel® Pentium® Processor	Legacy Intel® Celeron® Processor
Status	Launched	Discontinued
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	1.40 GHz	1.83 GHz
Bus Speed	5 GT/s DMI	667 MHz FSB
Die size	131 mm	143 mm2
L1 cache	128 KB
L2 cache	512 KB	1024 KB
L3 cache	2048 KB
Manufacturing process technology	32 nm	65 nm
Maximum core temperature	100 °C	100°C
Maximum frequency	1.4 GHz	1.83 GHz
Number of cores	2	2
Number of threads	2	2
Transistor count	504 million	291 million
Front-side bus (FSB)		667 MHz
VID voltage range		1.075V-1.175V
Memory
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	16.38 GB
Supported memory types	DDR3 1066/1333
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.00 GHz
Graphics max frequency	1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	31.0mm x 24.0mm (BGA1023)	35mm x 35mm
Sockets supported	FCBGA1023	PPGA478
Thermal Design Power (TDP)	17 Watt	35 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)