Intel Core 2 Duo L7200 vs Intel Pentium 977
Comparative analysis of Intel Core 2 Duo L7200 and Intel Pentium 977 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Pentium 977
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- Around 68% better performance in PassMark - CPU mark: 1148 vs 684
| Specifications (specs) | |
| Manufacturing process technology | 32 nm vs 65 nm |
| Benchmarks | |
| PassMark - CPU mark | 1148 vs 684 |
Compare benchmarks
CPU 1: Intel Core 2 Duo L7200
CPU 2: Intel Pentium 977
| PassMark - CPU mark |
|
|
| Name | Intel Core 2 Duo L7200 | Intel Pentium 977 |
|---|---|---|
| PassMark - Single thread mark | 0 | 0 |
| PassMark - CPU mark | 684 | 1148 |
Compare specifications (specs)
| Intel Core 2 Duo L7200 | Intel Pentium 977 | |
|---|---|---|
Essentials |
||
| Architecture codename | Merom | Sandy Bridge |
| Launch date | Q1'07 | 1 April 2012 |
| Place in performance rating | 3333 | 3331 |
| Processor Number | L7200 | 977 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Pentium® Processor |
| Status | Discontinued | Launched |
| Vertical segment | Mobile | Mobile |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.33 GHz | 1.40 GHz |
| Bus Speed | 667 MHz FSB | 5 GT/s DMI |
| Die size | 143 mm2 | 131 mm |
| Manufacturing process technology | 65 nm | 32 nm |
| Maximum core temperature | 100°C | 100 °C |
| Number of cores | 2 | 2 |
| Transistor count | 291 million | 504 million |
| VID voltage range | 0.9V-1.1V | |
| L1 cache | 128 KB | |
| L2 cache | 512 KB | |
| L3 cache | 2048 KB | |
| Maximum frequency | 1.4 GHz | |
| Number of threads | 2 | |
Compatibility |
||
| Low Halogen Options Available | ||
| Package Size | 35mm x 35mm | 31.0mm x 24.0mm (BGA1023) |
| Sockets supported | PBGA479 | FCBGA1023 |
| Thermal Design Power (TDP) | 17 Watt | 17 Watt |
| Max number of CPUs in a configuration | 1 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Anti-Theft technology | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| 4G WiMAX Wireless | ||
| Flexible Display interface (FDI) | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
| Intel® AES New Instructions | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® My WiFi technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Memory |
||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 21.3 GB/s | |
| Maximum memory size | 16.38 GB | |
| Supported memory types | DDR3 1066/1333 | |
Graphics |
||
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.00 GHz | |
| Graphics max frequency | 1 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel HD Graphics | |
Graphics interfaces |
||
| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 2 | |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Peripherals |
||
| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8, 1x8 2x4 | |