Intel Pentium M 780 vs AMD Mobile Sempron 3300+
Comparative analysis of Intel Pentium M 780 and AMD Mobile Sempron 3300+ processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Pentium M 780
- CPU is newer: launch date 1 month(s) later
- Around 13% higher clock speed: 2.26 GHz vs 2 GHz
- 16x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2.3x lower typical power consumption: 27 Watt vs 62 / 25 Watt
| Launch date | July 2005 vs 1 June 2005 |
| Maximum frequency | 2.26 GHz vs 2 GHz |
| L2 cache | 2048 KB vs 128 KB |
| Thermal Design Power (TDP) | 27 Watt vs 62 / 25 Watt |
Compare benchmarks
CPU 1: Intel Pentium M 780
CPU 2: AMD Mobile Sempron 3300+
| Name | Intel Pentium M 780 | AMD Mobile Sempron 3300+ |
|---|---|---|
| PassMark - Single thread mark | 574 | |
| PassMark - CPU mark | 445 |
Compare specifications (specs)
| Intel Pentium M 780 | AMD Mobile Sempron 3300+ | |
|---|---|---|
Essentials |
||
| Architecture codename | Dothan | Roma |
| Launch date | July 2005 | 1 June 2005 |
| Place in performance rating | not rated | 2896 |
| Processor Number | 780 | |
| Series | Legacy Intel® Pentium® Processor | AMD Mobile Sempron |
| Status | Discontinued | |
| Vertical segment | Mobile | Laptop |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.26 GHz | |
| Bus Speed | 533 MHz FSB | |
| Die size | 87 mm2 | |
| Front-side bus (FSB) | 533 MHz | 800 MHz |
| L1 cache | 32 KB | |
| L2 cache | 2048 KB | 128 KB |
| Manufacturing process technology | 90 nm | 90 nm |
| Maximum core temperature | 100°C | |
| Maximum frequency | 2.26 GHz | 2 GHz |
| Number of cores | 1 | 1 |
| Number of threads | 1 | 1 |
| Transistor count | 144 million | |
| VID voltage range | 1.260V-1.404V | |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 35mm x 35mm | |
| Sockets supported | PPGA478, H-PBGA479 | 745 |
| Thermal Design Power (TDP) | 27 Watt | 62 / 25 Watt |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Physical Address Extensions (PAE) | 32-bit | |
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||