Intel Xeon E5-1607 v3 vs Intel Core i9-7940X
Comparative analysis of Intel Xeon E5-1607 v3 and Intel Core i9-7940X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Xeon E5-1607 v3
- 6x more maximum memory size: 768 GB vs 128 GB
- Around 18% lower typical power consumption: 140 Watt vs 165 Watt
Maximum memory size | 768 GB vs 128 GB |
Thermal Design Power (TDP) | 140 Watt vs 165 Watt |
Reasons to consider the Intel Core i9-7940X
- CPU is newer: launch date 2 year(s) 11 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 10 more cores, run more applications at once: 14 vs 4
- 24 more threads: 28 vs 4
- Around 55% higher maximum core temperature: 102°C vs 66°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 3.5x more L1 cache, more data can be stored in the L1 cache for quick access later
- 14x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 93% more L3 cache; more data can be stored in the L3 cache for quick access later
Launch date | September 2017 vs 8 Sep 2014 |
Unlocked | Unlocked vs Locked |
Number of cores | 14 vs 4 |
Number of threads | 28 vs 4 |
Maximum core temperature | 102°C vs 66°C |
Manufacturing process technology | 14 nm vs 22 nm |
L1 cache | 64 KB (per core) vs 256 KB |
L2 cache | 1024 KB (per core) vs 1 MB |
L3 cache | 19712 KB (shared) vs 10 MB |
Compare benchmarks
CPU 1: Intel Xeon E5-1607 v3
CPU 2: Intel Core i9-7940X
Name | Intel Xeon E5-1607 v3 | Intel Core i9-7940X |
---|---|---|
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 8.386 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 91.366 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.545 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.929 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 42.254 | |
PassMark - Single thread mark | 2490 | |
PassMark - CPU mark | 25656 | |
Geekbench 4 - Single Core | 1153 | |
Geekbench 4 - Multi-Core | 12928 | |
3DMark Fire Strike - Physics Score | 10950 |
Compare specifications (specs)
Intel Xeon E5-1607 v3 | Intel Core i9-7940X | |
---|---|---|
Essentials |
||
Architecture codename | Haswell | Skylake |
Launch date | 8 Sep 2014 | September 2017 |
Launch price (MSRP) | $255 | $1,399 |
Place in performance rating | 2231 | 718 |
Processor Number | E5-1607V3 | i9-7940X |
Series | Intel Xeon Processor E5 v3 Family | Intel® Core™ X-series Processors |
Status | Launched | Launched |
Vertical segment | Server | Desktop |
Price now | $1,129.99 | |
Value for money (0-100) | 6.63 | |
Performance |
||
64 bit support | ||
Base frequency | 3.10 GHz | 3.10 GHz |
Bus Speed | 0 GT/s | 8 GT/s DMI3 |
L1 cache | 256 KB | 64 KB (per core) |
L2 cache | 1 MB | 1024 KB (per core) |
L3 cache | 10 MB | 19712 KB (shared) |
Manufacturing process technology | 22 nm | 14 nm |
Maximum core temperature | 66°C | 102°C |
Number of cores | 4 | 14 |
Number of QPI Links | 0 | 0 |
Number of threads | 4 | 28 |
VID voltage range | 0.65–1.30V | |
Maximum frequency | 4.30 GHz | |
Unlocked | ||
Memory |
||
Max memory channels | 4 | 4 |
Maximum memory bandwidth | 59 GB/s | |
Maximum memory size | 768 GB | 128 GB |
Supported memory types | DDR4 1333/1600/1866 | DDR4-2666 |
Compatibility |
||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 52.5mm x 45.0 mm | |
Sockets supported | FCLGA2011-3 | FCLGA2066 |
Thermal Design Power (TDP) | 140 Watt | 165 Watt |
Low Halogen Options Available | ||
Thermal Solution | PCG 2017X | |
Peripherals |
||
Max number of PCIe lanes | 40 | 44 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | x4, x8, x16 | |
Scalability | 1S Only | 1S Only |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2, Intel® AVX-512 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 46-bit | |
Thermal Monitoring | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Optane™ Memory Supported | ||
Number of AVX-512 FMA Units | 2 | |
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |