Intel Xeon E5-2683 v3 vs AMD E1-2150

Comparative analysis of Intel Xeon E5-2683 v3 and AMD E1-2150 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Xeon E5-2683 v3

  • 12 more cores, run more applications at once: 14 vs 2
  • Around 186% higher clock speed: 3.00 GHz vs 1.05 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
Number of cores 14 vs 2
Maximum frequency 3.00 GHz vs 1.05 GHz
Manufacturing process technology 22 nm vs 32 nm
Max number of CPUs in a configuration 2 vs 1

Reasons to consider the AMD E1-2150

  • 13.3x lower typical power consumption: 9 Watt vs 120 Watt
Thermal Design Power (TDP) 9 Watt vs 120 Watt

Compare benchmarks

CPU 1: Intel Xeon E5-2683 v3
CPU 2: AMD E1-2150

Name Intel Xeon E5-2683 v3 AMD E1-2150
PassMark - Single thread mark 1649
PassMark - CPU mark 23746
Geekbench 4 - Single Core 700
Geekbench 4 - Multi-Core 7687

Compare specifications (specs)

Intel Xeon E5-2683 v3 AMD E1-2150

Essentials

Architecture codename Haswell Kabini
Launch date Q3'14 February 2014
Place in performance rating 1384 not rated
Processor Number E5-2683V3
Series Intel® Xeon® Processor E5 v3 Family
Status Launched
Vertical segment Server Laptop

Performance

64 bit support
Base frequency 2.00 GHz
Bus Speed 9.6 GT/s QPI
Manufacturing process technology 22 nm 32 nm
Maximum core temperature 82.5°C
Maximum frequency 3.00 GHz 1.05 GHz
Number of cores 14 2
Number of QPI Links 2
Number of threads 28
VID voltage range 0.65V–1.30V
Die size 246 mm
L1 cache 128 KB (per core)
L2 cache 512 KB (per core)
Maximum case temperature (TCase) 90 °C
Transistor count 1178 million

Memory

Max memory channels 4
Maximum memory bandwidth 68 GB/s
Maximum memory size 768 GB
Supported memory types DDR4 1600/1866/2133 DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2 1
Package Size 52.5mm x 51mm
Sockets supported FCLGA2011-3 FT3
Thermal Design Power (TDP) 120 Watt 9 Watt

Peripherals

Max number of PCIe lanes 40
PCI Express revision 3.0
PCIe configurations x4, x8, x16
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring
Intel® Advanced Vector Extensions (AVX)

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)