Intel Xeon E5-2697 v2 vs Intel Xeon E3-1230

Comparative analysis of Intel Xeon E5-2697 v2 and Intel Xeon E3-1230 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), 3DMark Fire Strike - Physics Score.

Intel Xeon E5-2697 v2

Intel Xeon E3-1230

Differences

Reasons to consider the Intel Xeon E5-2697 v2

CPU is newer: launch date 2 year(s) 5 month(s) later
8 more cores, run more applications at once: 12 vs 4
16 more threads: 24 vs 8
Around 24% higher maximum core temperature: 86°C vs 69.1°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
3x more L1 cache, more data can be stored in the L1 cache for quick access later
3x more L2 cache, more data can be stored in the L2 cache for quick access later
3.8x more L3 cache, more data can be stored in the L3 cache for quick access later
24x more maximum memory size: 768 GB vs 32 GB
Around 3% better performance in PassMark - Single thread mark: 1711 vs 1664
4.4x better performance in PassMark - CPU mark: 22837 vs 5139
2.7x better performance in Geekbench 4 - Multi-Core: 6947 vs 2613

Specifications (specs)
Launch date	10 September 2013 vs April 2011
Number of cores	12 vs 4
Number of threads	24 vs 8
Maximum core temperature	86°C vs 69.1°C
Manufacturing process technology	22 nm vs 32 nm
L1 cache	768 KB vs 64 KB (per core)
L2 cache	3 MB vs 256 KB (per core)
L3 cache	30 MB vs 8192 KB (shared)
Maximum memory size	768 GB vs 32 GB
Max number of CPUs in a configuration	2 vs 1
Benchmarks
PassMark - Single thread mark	1711 vs 1664
PassMark - CPU mark	22837 vs 5139
Geekbench 4 - Multi-Core	6947 vs 2613

Reasons to consider the Intel Xeon E3-1230

Around 3% higher clock speed: 3.60 GHz vs 3.50 GHz
Around 63% lower typical power consumption: 80 Watt vs 130 Watt
Around 5% better performance in Geekbench 4 - Single Core: 685 vs 654

Specifications (specs)
Maximum frequency	3.60 GHz vs 3.50 GHz
Thermal Design Power (TDP)	80 Watt vs 130 Watt
Benchmarks
Geekbench 4 - Single Core	685 vs 654

Compare benchmarks

CPU 1: Intel Xeon E5-2697 v2
CPU 2: Intel Xeon E3-1230

PassMark - Single thread mark

CPU 1

CPU 2

1711

1664

PassMark - CPU mark

CPU 1

CPU 2

22837

5139

Geekbench 4 - Single Core

CPU 1

CPU 2

654

685

Geekbench 4 - Multi-Core

CPU 1

CPU 2

6947

2613

Name	Intel Xeon E5-2697 v2	Intel Xeon E3-1230
PassMark - Single thread mark	1711	1664
PassMark - CPU mark	22837	5139
Geekbench 4 - Single Core	654	685
Geekbench 4 - Multi-Core	6947	2613
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	11.052
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	75.574
CompuBench 1.5 Desktop - T-Rex (Frames/s)	1.157
CompuBench 1.5 Desktop - Video Composition (Frames/s)	5.429
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	14.769
3DMark Fire Strike - Physics Score		5668

Compare specifications (specs)

	Intel Xeon E5-2697 v2	Intel Xeon E3-1230
Essentials
Architecture codename	Ivy Bridge EP	Sandy Bridge
Launch date	10 September 2013	April 2011
Launch price (MSRP)	$1,723	$428
Place in performance rating	1711	1722
Price now	$2,235.02	$215
Processor Number	E5-2697V2	E3-1230
Series	Intel® Xeon® Processor E5 v2 Family	Intel® Xeon® Processor E3 Family
Status	Launched	Discontinued
Value for money (0-100)	2.30	10.75
Vertical segment	Server	Server
Performance
64 bit support
Base frequency	2.70 GHz	3.20 GHz
Bus Speed	8 GT/s QPI	5 GT/s DMI
Die size	160 mm	216 mm
Front-side bus (FSB)	8GT / s
L1 cache	768 KB	64 KB (per core)
L2 cache	3 MB	256 KB (per core)
L3 cache	30 MB	8192 KB (shared)
Manufacturing process technology	22 nm	32 nm
Maximum core temperature	86°C	69.1°C
Maximum frequency	3.50 GHz	3.60 GHz
Number of cores	12	4
Number of QPI Links	2
Number of threads	24	8
Transistor count	1400 million	1160 million
VID voltage range	0.65–1.30V
Memory
ECC memory support
Max memory channels	4	2
Maximum memory bandwidth	59.7 GB/s	21 GB/s
Maximum memory size	768 GB	32 GB
Supported memory types	DDR3 800/1066/1333/1600/1866	DDR3 1066/1333
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	2	1
Package Size	52.5mm x 51mm	37.5mm x 37.5mm
Sockets supported	FCLGA2011	LGA1155
Thermal Design Power (TDP)	130 Watt	80 Watt
Peripherals
Max number of PCIe lanes	40	20
PCI Express revision	3.0	2.0
PCIe configurations	x4, x8, x16
Scalability	2S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® AVX	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	46-bit
Thermal Monitoring
Flexible Display interface (FDI)
Intel® Fast Memory Access
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Graphics
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Graphics interfaces
Wireless Display (WiDi) support