Intel Xeon Phi 7290 vs AMD A9-9410 SoC
Comparative analysis of Intel Xeon Phi 7290 and AMD A9-9410 SoC processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Xeon Phi 7290
- CPU is newer: launch date 1 month(s) later
- 70 more cores, run more applications at once: 72 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 28 nm
- 9x more L1 cache, more data can be stored in the L1 cache for quick access later
- 18x more L2 cache, more data can be stored in the L2 cache for quick access later
| Launch date | June 2016 vs May 2016 |
| Number of cores | 72 vs 2 |
| Manufacturing process technology | 14 nm vs 28 nm |
| L1 cache | 32 KB (per core) vs 128 KB (per core) |
| L2 cache | 512 KB (per core) vs 1024 KB (per core) |
Reasons to consider the AMD A9-9410 SoC
- Around 71% higher clock speed: 2.9 GHz vs 1.70 GHz
- 9.8x lower typical power consumption: 25 Watt vs 245 Watt
| Maximum frequency | 2.9 GHz vs 1.70 GHz |
| Thermal Design Power (TDP) | 25 Watt vs 245 Watt |
Compare specifications (specs)
| Intel Xeon Phi 7290 | AMD A9-9410 SoC | |
|---|---|---|
Essentials |
||
| Architecture codename | Knights Landing | Stoney Ridge |
| Launch date | June 2016 | May 2016 |
| Place in performance rating | not rated | not rated |
| Processor Number | 7290 | |
| Series | Intel® Xeon Phi™ x200 Product Family | |
| Status | Launched | |
| Vertical segment | Server | Desktop |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.50 GHz | |
| L1 cache | 32 KB (per core) | 128 KB (per core) |
| L2 cache | 512 KB (per core) | 1024 KB (per core) |
| Manufacturing process technology | 14 nm | 28 nm |
| Maximum frequency | 1.70 GHz | 2.9 GHz |
| Number of cores | 72 | 2 |
| Transistor count | 8000 million | 1200 million |
| VID voltage range | 0.550-1.125V | |
| Die size | 124 mm | |
| Maximum case temperature (TCase) | 74 °C | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 6 | |
| Maximum memory bandwidth | 115.2 GB/s | |
| Maximum memory size | 384 GB | |
| Supported memory types | DDR4-2400 | DDR4 |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Sockets supported | SVLCLGA3647 | |
| Thermal Design Power (TDP) | 245 Watt | 25 Watt |
Peripherals |
||
| Max number of PCIe lanes | 36 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | x16 port (Port 2 and 3) may negotiate down to x8, x4, x2, or x1. x4 port (Port 1) may negotiate down to x2, or x1 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
||
| Idle States | ||
| Instruction set extensions | Intel® AVX-512 | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| Fused Multiply-Add (FMA) | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
| AMD Virtualization (AMD-V™) | ||
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