Intel Xeon Phi SE10X vs Intel Atom D2560
Comparative analysis of Intel Xeon Phi SE10X and Intel Atom D2560 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon Phi SE10X
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 59 more cores, run more applications at once: 61 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- 30.5x more L2 cache, more data can be stored in the L2 cache for quick access later
Unlocked | Unlocked vs Locked |
Number of cores | 61 vs 2 |
Manufacturing process technology | 22 nm vs 32 nm |
L2 cache | 512 KB (per core) vs 1 MB |
Reasons to consider the Intel Atom D2560
- Around 82% higher clock speed: 2 GHz vs 1.1 GHz
- 30x lower typical power consumption: 10 Watt vs 300 Watt
Maximum frequency | 2 GHz vs 1.1 GHz |
Thermal Design Power (TDP) | 10 Watt vs 300 Watt |
Compare benchmarks
CPU 1: Intel Xeon Phi SE10X
CPU 2: Intel Atom D2560
Name | Intel Xeon Phi SE10X | Intel Atom D2560 |
---|---|---|
PassMark - Single thread mark | 353 | |
PassMark - CPU mark | 433 |
Compare specifications (specs)
Intel Xeon Phi SE10X | Intel Atom D2560 | |
---|---|---|
Essentials |
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Architecture codename | Knights Corner | Cedarview |
Launch date | November 2012 | 24 October 2012 |
Place in performance rating | not rated | 3190 |
Vertical segment | Server | Laptop |
Series | Intel Atom | |
Performance |
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64 bit support | ||
Die size | 350 mm | |
L1 cache | 32 KB (per core) | |
L2 cache | 512 KB (per core) | 1 MB |
Manufacturing process technology | 22 nm | 32 nm |
Maximum frequency | 1.1 GHz | 2 GHz |
Number of cores | 61 | 2 |
Transistor count | 5000 million | |
Unlocked | ||
Number of threads | 4 | |
Memory |
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Supported memory types | DDR3, DDR4 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | |
Thermal Design Power (TDP) | 300 Watt | 10 Watt |
Sockets supported | FCBGA559 | |
Security & Reliability |
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Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® vPro™ Platform Eligibility | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |