Intel Xeon Platinum 8176F vs Intel Xeon Platinum 8168

Comparative analysis of Intel Xeon Platinum 8176F and Intel Xeon Platinum 8168 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Xeon Platinum 8176F

Intel Xeon Platinum 8168

Differences

Reasons to consider the Intel Xeon Platinum 8176F

4 more cores, run more applications at once: 28 vs 24
8 more threads: 56 vs 48
Around 3% higher clock speed: 3.80 GHz vs 3.70 GHz
Around 2% higher maximum core temperature: 87°C vs 85°C
Around 18% lower typical power consumption: 173 Watt vs 205 Watt

Number of cores	28 vs 24
Number of threads	56 vs 48
Maximum frequency	3.80 GHz vs 3.70 GHz
Maximum core temperature	87°C vs 85°C
Thermal Design Power (TDP)	173 Watt vs 205 Watt

Compare benchmarks

CPU 1: Intel Xeon Platinum 8176F
CPU 2: Intel Xeon Platinum 8168

Name	Intel Xeon Platinum 8176F	Intel Xeon Platinum 8168
PassMark - Single thread mark		2107
PassMark - CPU mark		54699

Compare specifications (specs)

	Intel Xeon Platinum 8176F	Intel Xeon Platinum 8168
Essentials
Architecture codename	Skylake	Skylake
Launch date	Q3'17	Q3'17
Place in performance rating	not rated	494
Processor Number	8176F	8168
Series	Intel® Xeon® Scalable Processors	Intel® Xeon® Scalable Processors
Status	Launched	Launched
Vertical segment	Server	Server
Performance
Base frequency	2.10 GHz	2.70 GHz
Manufacturing process technology	14 nm	14 nm
Maximum core temperature	87°C	85°C
Maximum frequency	3.80 GHz	3.70 GHz
Number of cores	28	24
Number of threads	56	48
Number of Ultra Path Interconnect (UPI) Links	2	3
Memory
Max memory channels	6	6
Maximum memory size	768 GB	768 GB
Supported memory frequency	2666 MHz	2666 MHz
Supported memory types	DDR4-2666	DDR4-2666
Compatibility
Low Halogen Options Available
Package Size	88.0mm x 56.5mm	76.0mm x 56.5mm
Sockets supported	FCLGA3647	FCLGA3647
Thermal Design Power (TDP)	173 Watt	205 Watt
Peripherals
Max number of PCIe lanes	48	48
PCI Express revision	3.0	3.0
Scalability	2S	S8S
Security & Reliability
Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Instruction set extensions	Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512	Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Integrated Intel® Omni-Path Architecture (Intel® OPA)
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units	2	2
Speed Shift technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)