Intel Xeon Platinum 8176F vs Intel Xeon Platinum 8170

Comparative analysis of Intel Xeon Platinum 8176F and Intel Xeon Platinum 8170 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Xeon Platinum 8176F

  • 2 more cores, run more applications at once: 28 vs 26
  • 4 more threads: 56 vs 52
  • Around 3% higher clock speed: 3.80 GHz vs 3.70 GHz
Number of cores 28 vs 26
Number of threads 56 vs 52
Maximum frequency 3.80 GHz vs 3.70 GHz

Reasons to consider the Intel Xeon Platinum 8170

  • Around 2% higher maximum core temperature: 89°C vs 87°C
  • Around 5% lower typical power consumption: 165 Watt vs 173 Watt
Maximum core temperature 89°C vs 87°C
Thermal Design Power (TDP) 165 Watt vs 173 Watt

Compare benchmarks

CPU 1: Intel Xeon Platinum 8176F
CPU 2: Intel Xeon Platinum 8170

Name Intel Xeon Platinum 8176F Intel Xeon Platinum 8170
Geekbench 4 - Single Core 4221
Geekbench 4 - Multi-Core 33793

Compare specifications (specs)

Intel Xeon Platinum 8176F Intel Xeon Platinum 8170

Essentials

Architecture codename Skylake Skylake
Launch date Q3'17 Q3'17
Place in performance rating not rated 4
Processor Number 8176F 8170
Series Intel® Xeon® Scalable Processors Intel® Xeon® Scalable Processors
Status Launched Launched
Vertical segment Server Server

Performance

Base frequency 2.10 GHz 2.10 GHz
Manufacturing process technology 14 nm 14 nm
Maximum core temperature 87°C 89°C
Maximum frequency 3.80 GHz 3.70 GHz
Number of cores 28 26
Number of threads 56 52
Number of Ultra Path Interconnect (UPI) Links 2 3

Memory

Max memory channels 6 6
Maximum memory size 768 GB 768 GB
Supported memory frequency 2666 MHz 2666 MHz
Supported memory types DDR4-2666 DDR4-2666

Compatibility

Low Halogen Options Available
Package Size 88.0mm x 56.5mm 76.0mm x 56.5mm
Sockets supported FCLGA3647 FCLGA3647
Thermal Design Power (TDP) 173 Watt 165 Watt

Peripherals

Max number of PCIe lanes 48 48
PCI Express revision 3.0 3.0
Scalability 2S S8S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Instruction set extensions Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Integrated Intel® Omni-Path Architecture (Intel® OPA)
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units 2 2
Speed Shift technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

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