Intel Xeon Platinum 8468 vs Intel Xeon Platinum 8170

Comparative analysis of Intel Xeon Platinum 8468 and Intel Xeon Platinum 8170 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Xeon Platinum 8468

Intel Xeon Platinum 8170

Differences

Reasons to consider the Intel Xeon Platinum 8468

22 more cores, run more applications at once: 48 vs 26
44 more threads: 96 vs 52
Around 3% higher clock speed: 3.8 GHz vs 3.70 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm

Number of cores	48 vs 26
Number of threads	96 vs 52
Maximum frequency	3.8 GHz vs 3.70 GHz
Manufacturing process technology	10 nm vs 14 nm

Reasons to consider the Intel Xeon Platinum 8170

2.1x lower typical power consumption: 165 Watt vs 350 Watt

Thermal Design Power (TDP)	165 Watt vs 350 Watt

Compare benchmarks

CPU 1: Intel Xeon Platinum 8468
CPU 2: Intel Xeon Platinum 8170

Name	Intel Xeon Platinum 8468	Intel Xeon Platinum 8170
PassMark - Single thread mark	3156
PassMark - CPU mark	126838
Geekbench 4 - Single Core		4221
Geekbench 4 - Multi-Core		33793

Compare specifications (specs)

	Intel Xeon Platinum 8468	Intel Xeon Platinum 8170
Essentials
Launch date	10 Jan 2023	Q3'17
Launch price (MSRP)	$7214
Place in performance rating	14	2
Architecture codename		Skylake
Processor Number		8170
Series		Intel® Xeon® Scalable Processors
Status		Launched
Vertical segment		Server
Performance
Base frequency	2.1 GHz	2.10 GHz
Die size	4x 477 mm²
L1 cache	80 KB (per core)
L2 cache	2 MB (per core)
L3 cache	105 MB
Manufacturing process technology	10 nm	14 nm
Maximum case temperature (TCase)	79°C
Maximum frequency	3.8 GHz	3.70 GHz
Number of cores	48	26
Number of threads	96	52
Unlocked
Maximum core temperature		89°C
Number of Ultra Path Interconnect (UPI) Links		3
Memory
ECC memory support
Supported memory types	DDR5	DDR4-2666
Max memory channels		6
Maximum memory size		768 GB
Supported memory frequency		2666 MHz
Compatibility
Max number of CPUs in a configuration	2
Sockets supported	4677	FCLGA3647
Thermal Design Power (TDP)	350 Watt	165 Watt
Low Halogen Options Available
Package Size		76.0mm x 56.5mm
Peripherals
PCIe configurations	Gen 5, 80 Lanes, (CPU only)
Max number of PCIe lanes		48
PCI Express revision		3.0
Scalability		S8S
Security & Reliability
Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Instruction set extensions		Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units		2
Speed Shift technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)