Intel Xeon W-11555MRE vs Intel Core i7-6700TE
Comparative analysis of Intel Xeon W-11555MRE and Intel Core i7-6700TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Xeon W-11555MRE
- 2 more cores, run more applications at once: 6 vs 4
- 4 more threads: 12 vs 8
- Around 32% higher clock speed: 4.50 GHz vs 3.40 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm SuperFin vs 14 nm
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
- 2x more maximum memory size: 128 GB vs 64 GB
- Around 56% better performance in PassMark - Single thread mark: 3201 vs 2051
- 2.9x better performance in PassMark - CPU mark: 17484 vs 6109
Specifications (specs) | |
Number of cores | 6 vs 4 |
Number of threads | 12 vs 8 |
Maximum frequency | 4.50 GHz vs 3.40 GHz |
Manufacturing process technology | 10 nm SuperFin vs 14 nm |
L3 cache | 12 MB vs 8192 KB (shared) |
Maximum memory size | 128 GB vs 64 GB |
Benchmarks | |
PassMark - Single thread mark | 3201 vs 2051 |
PassMark - CPU mark | 17484 vs 6109 |
Compare benchmarks
CPU 1: Intel Xeon W-11555MRE
CPU 2: Intel Core i7-6700TE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon W-11555MRE | Intel Core i7-6700TE |
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PassMark - Single thread mark | 3201 | 2051 |
PassMark - CPU mark | 17484 | 6109 |
Geekbench 4 - Single Core | 3912 | |
Geekbench 4 - Multi-Core | 11914 |
Compare specifications (specs)
Intel Xeon W-11555MRE | Intel Core i7-6700TE | |
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Essentials |
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Architecture codename | Tiger Lake | Skylake |
Launch date | Q3'21 | 19 October 2015 |
Launch price (MSRP) | $359 | |
Place in performance rating | 519 | 536 |
Processor Number | W-11555MRE | i7-6700TE |
Series | Intel Xeon W Processor | 6th Generation Intel® Core™ i7 Processors |
Vertical segment | Embedded | Embedded |
Status | Launched | |
Performance |
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64 bit support | ||
L3 cache | 12 MB | 8192 KB (shared) |
Manufacturing process technology | 10 nm SuperFin | 14 nm |
Maximum core temperature | 100°C | |
Maximum frequency | 4.50 GHz | 3.40 GHz |
Number of cores | 6 | 4 |
Number of threads | 12 | 8 |
Base frequency | 2.40 GHz | |
Bus Speed | 8 GT/s DMI3 | |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory size | 128 GB | 64 GB |
Supported memory types | DDR4-3200 | DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V |
Maximum memory bandwidth | 34.1 GB/s | |
Graphics |
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Device ID | 0x9A70 | 0x1912 |
Execution Units | 32 | |
Graphics base frequency | 350 MHz | 350 MHz |
Graphics max dynamic frequency | 1.35 GHz | 1.00 GHz |
Intel® Quick Sync Video | ||
Processor graphics | Intel UHD Graphics for 11th Gen Intel Processors | Intel® HD Graphics 530 |
Graphics max frequency | 1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Max video memory | 64 GB | |
Graphics interfaces |
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Number of displays supported | 4 | 3 |
DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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Max resolution over DisplayPort | 7680x4320@60Hz | 4096x2304@60Hz |
Max resolution over eDP | 4096x2304@60Hz | 4096x2304@60Hz |
4K resolution support | ||
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Max resolution over VGA | N / A | |
Max resolution over WiDi | 1080p | |
Graphics API support |
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DirectX | 12.1 | 12 |
OpenGL | 4.6 | 4.5 |
Compatibility |
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Configurable TDP-down | 35 Watt | |
Configurable TDP-up | 45 Watt | |
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 50 x 26.5 | 37.5mm x 37.5mm |
Sockets supported | FCBGA1787 | FCLGA1151 |
Low Halogen Options Available | ||
Thermal Design Power (TDP) | 35 Watt | |
Thermal Solution | PCG 2015A (35W) | |
Peripherals |
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Max number of PCIe lanes | 20 | 16 |
PCIe configurations | Up to 1x16+1x4, 2x8+1x4, 1x8+3x4 | Up to 1x16, 2x8, 1x8+2x4 |
PCI Express revision | 3.0 | |
Scalability | 1S Only | |
Security & Reliability |
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Intel® OS Guard | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® Secure Key technology | ||
Advanced Technologies |
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Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Number of AVX-512 FMA Units | 6 | |
Speed Shift technology | ||
Thermal Monitoring | ||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® vPro™ Platform Eligibility | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |