Intel Xeon W-1270TE vs AMD Ryzen 9 4900H
Comparative analysis of Intel Xeon W-1270TE and AMD Ryzen 9 4900H processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Xeon W-1270TE
- CPU is newer: launch date 1 month(s) later
- Around 33% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 29% lower typical power consumption: 35 Watt vs 45 Watt
- Around 3% better performance in PassMark - Single thread mark: 2796 vs 2707
Specifications (specs) | |
Launch date | 13 may 2020 vs 16 Mar 2020 |
L3 cache | 16 MB vs 12 MB |
Thermal Design Power (TDP) | 35 Watt vs 45 Watt |
Benchmarks | |
PassMark - Single thread mark | 2796 vs 2707 |
Reasons to consider the AMD Ryzen 9 4900H
- Around 5% higher maximum core temperature: 105 °C vs 100°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 41% better performance in PassMark - CPU mark: 19150 vs 13553
Specifications (specs) | |
Maximum core temperature | 105 °C vs 100°C |
Manufacturing process technology | 7 nm vs 14 nm |
L1 cache | 1 MB vs 512 KB |
L2 cache | 4 MB vs 2 MB |
Benchmarks | |
PassMark - CPU mark | 19150 vs 13553 |
Compare benchmarks
CPU 1: Intel Xeon W-1270TE
CPU 2: AMD Ryzen 9 4900H
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon W-1270TE | AMD Ryzen 9 4900H |
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PassMark - Single thread mark | 2796 | 2707 |
PassMark - CPU mark | 13553 | 19150 |
3DMark Fire Strike - Physics Score | 8370 |
Compare specifications (specs)
Intel Xeon W-1270TE | AMD Ryzen 9 4900H | |
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Essentials |
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Architecture codename | Comet Lake | Zen 2 |
Launch date | 13 may 2020 | 16 Mar 2020 |
Launch price (MSRP) | $367 | |
Place in performance rating | 742 | 717 |
Processor Number | W-1270TE | |
Series | Intel Xeon W Processor | |
Status | Launched | |
Vertical segment | Embedded | Laptop |
Performance |
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64 bit support | ||
Base frequency | 2.00 GHz | 3.3 GHz |
Bus Speed | 8 GT/s | |
L1 cache | 512 KB | 1 MB |
L2 cache | 2 MB | 4 MB |
L3 cache | 16 MB | 12 MB |
Manufacturing process technology | 14 nm | 7 nm |
Maximum core temperature | 100°C | 105 °C |
Maximum frequency | 4.40 GHz | 4.4 GHz |
Number of cores | 8 | |
Number of GPU cores | 8 | |
Number of threads | 16 | |
Unlocked | ||
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 45.8 GB/s | |
Maximum memory size | 128 GB | |
Supported memory types | DDR4-2933 | DDR4-3200, LPDDR4-4266 |
Graphics |
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Device ID | 0x9BC6 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.15 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel UHD Graphics 630 | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1200 | FP6 |
Thermal Design Power (TDP) | 35 Watt | 45 Watt |
Thermal Solution | PCG 2015B | |
Configurable TDP | 35-54 Watt | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Intel® Advanced Vector Extensions (AVX) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |