Intel Xeon X5690 vs Intel Xeon L5506
Comparative analysis of Intel Xeon X5690 and Intel Xeon L5506 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon X5690
- CPU is newer: launch date 1 year(s) 11 month(s) later
- 2 more cores, run more applications at once: 6 vs 4
- 8 more threads: 12 vs 4
- Around 75% higher clock speed: 3.73 GHz vs 2.13 GHz
- Around 12% higher maximum core temperature: 78.5°C vs 70°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
- 3x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2x more maximum memory size: 288 GB vs 144 GB
- Around 77% better performance in PassMark - Single thread mark: 1714 vs 967
- 3.2x better performance in PassMark - CPU mark: 12925 vs 4019
Specifications (specs) | |
Launch date | February 2011 vs March 2009 |
Number of cores | 6 vs 4 |
Number of threads | 12 vs 4 |
Maximum frequency | 3.73 GHz vs 2.13 GHz |
Maximum core temperature | 78.5°C vs 70°C |
Manufacturing process technology | 32 nm vs 45 nm |
L1 cache | 64 KB (per core) vs 64 KB (per core) |
L2 cache | 256 KB (per core) vs 256 KB (per core) |
L3 cache | 12288 KB (shared) vs 4096 KB (shared) |
Maximum memory size | 288 GB vs 144 GB |
Benchmarks | |
PassMark - Single thread mark | 1714 vs 967 |
PassMark - CPU mark | 12925 vs 4019 |
Reasons to consider the Intel Xeon L5506
- 2.2x lower typical power consumption: 60 Watt vs 130 Watt
Thermal Design Power (TDP) | 60 Watt vs 130 Watt |
Compare benchmarks
CPU 1: Intel Xeon X5690
CPU 2: Intel Xeon L5506
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon X5690 | Intel Xeon L5506 |
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PassMark - Single thread mark | 1714 | 967 |
PassMark - CPU mark | 12925 | 4019 |
Geekbench 4 - Single Core | 637 | |
Geekbench 4 - Multi-Core | 3517 | |
3DMark Fire Strike - Physics Score | 0 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 3.301 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 57.148 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.762 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 5.122 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 15.77 |
Compare specifications (specs)
Intel Xeon X5690 | Intel Xeon L5506 | |
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Essentials |
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Architecture codename | Westmere EP | Nehalem EP |
Launch date | February 2011 | March 2009 |
Launch price (MSRP) | $205 | $125 |
Place in performance rating | 2252 | 2234 |
Price now | $149 | $224 |
Processor Number | X5690 | L5506 |
Series | Legacy Intel® Xeon® Processors | Legacy Intel® Xeon® Processors |
Status | Discontinued | Launched |
Value for money (0-100) | 17.68 | 4.88 |
Vertical segment | Server | Server |
Performance |
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64 bit support | ||
Base frequency | 3.46 GHz | 2.13 GHz |
Bus Speed | 6.4 GT/s QPI | 4.8 GT/s QPI |
Die size | 239 mm | 263 mm |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 256 KB (per core) | 256 KB (per core) |
L3 cache | 12288 KB (shared) | 4096 KB (shared) |
Manufacturing process technology | 32 nm | 45 nm |
Maximum core temperature | 78.5°C | 70°C |
Maximum frequency | 3.73 GHz | 2.13 GHz |
Number of cores | 6 | 4 |
Number of QPI Links | 2 | 2 |
Number of threads | 12 | 4 |
Transistor count | 1170 million | 731 million |
VID voltage range | 0.750V-1.350V | 0.75V -1.35V |
Memory |
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ECC memory support | ||
Max memory channels | 3 | 3 |
Maximum memory bandwidth | 32 GB/s | 19.2 GB/s |
Maximum memory size | 288 GB | 144 GB |
Supported memory types | DDR3 800/1066/1333 | DDR3 800 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | 2 |
Package Size | 42.5mm X 45mm | 42.5mm x 45mm |
Sockets supported | FCLGA1366 | FCLGA1366 |
Thermal Design Power (TDP) | 130 Watt | 60 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 40-bit | 40-bit |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |