Intel Xeon X7350 vs Intel Xeon E5-2609 v2
Comparative analysis of Intel Xeon X7350 and Intel Xeon E5-2609 v2 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon X7350
- Around 14% better performance in PassMark - CPU mark: 7836 vs 6844
Benchmarks | |
PassMark - CPU mark | 7836 vs 6844 |
Reasons to consider the Intel Xeon E5-2609 v2
- Around 8% higher maximum core temperature: 71°C vs 66°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
- 1310720x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 63% lower typical power consumption: 80 Watt vs 130 Watt
- Around 17% better performance in PassMark - Single thread mark: 1383 vs 1186
Specifications (specs) | |
Maximum core temperature | 71°C vs 66°C |
Manufacturing process technology | 22 nm vs 65 nm |
L3 cache | 10240 KB (shared) vs 8 MB L2 Cache |
Thermal Design Power (TDP) | 80 Watt vs 130 Watt |
Benchmarks | |
PassMark - Single thread mark | 1383 vs 1186 |
Compare benchmarks
CPU 1: Intel Xeon X7350
CPU 2: Intel Xeon E5-2609 v2
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon X7350 | Intel Xeon E5-2609 v2 |
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PassMark - Single thread mark | 1186 | 1383 |
PassMark - CPU mark | 7836 | 6844 |
Geekbench 4 - Single Core | 2508 | |
Geekbench 4 - Multi-Core | 7539 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 4.725 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 79.456 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.431 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.525 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 8.253 |
Compare specifications (specs)
Intel Xeon X7350 | Intel Xeon E5-2609 v2 | |
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Essentials |
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Architecture codename | Tigerton | Ivy Bridge EP |
Launch date | Q3'07 | September 2013 |
Place in performance rating | 1853 | 1840 |
Processor Number | X7350 | E5-2609V2 |
Series | Legacy Intel Xeon Processors | Intel® Xeon® Processor E5 v2 Family |
Vertical segment | Server | Server |
Launch price (MSRP) | $396 | |
Price now | $509.95 | |
Status | Launched | |
Value for money (0-100) | 2.97 | |
Performance |
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64 bit support | ||
Base frequency | 2.93 GHz | 2.50 GHz |
Bus Speed | 1066 MHz | 6.4 GT/s QPI |
Die size | 286 mm2 | 160 mm |
L3 cache | 8 MB L2 Cache | 10240 KB (shared) |
Manufacturing process technology | 65 nm | 22 nm |
Maximum core temperature | 66°C | 71°C |
Number of cores | 4 | 4 |
Transistor count | 582 million | 1400 million |
VID voltage range | 1.0000V-1.5000V | 0.65–1.30V |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
Maximum frequency | 2.50 GHz | |
Number of QPI Links | 2 | |
Number of threads | 4 | |
Compatibility |
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Package Size | 53.3mm x 53.3mm | 52.5mm x 45mm |
Sockets supported | PGA604, PPGA604 | FCLGA2011 |
Thermal Design Power (TDP) | 130 Watt | 80 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Instruction set extensions | Intel® AVX | |
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Flex Memory Access | ||
Intel® TSX-NI | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 46-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Memory |
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ECC memory support | ||
Max memory channels | 4 | |
Maximum memory bandwidth | 42.6 GB/s | |
Maximum memory size | 768 GB | |
Supported memory types | DDR3 800/1066/1333 | |
Peripherals |
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Max number of PCIe lanes | 40 | |
PCI Express revision | 3.0 | |
PCIe configurations | x4, x8, x16 | |
Scalability | 2S Only |