VIA Nano QuadCore L4700 vs Intel Core i3-2350M

Comparative analysis of VIA Nano QuadCore L4700 and Intel Core i3-2350M processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Graphics, Graphics interfaces, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the VIA Nano QuadCore L4700

  • 2 more cores, run more applications at once: 4 vs 2
  • 4x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 8x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 25% lower typical power consumption: 27.5 Watt vs 35 Watt
Number of cores 4 vs 2
L1 cache 512 KB vs 128 KB
L2 cache 4 MB vs 512 KB
Thermal Design Power (TDP) 27.5 Watt vs 35 Watt

Reasons to consider the Intel Core i3-2350M

  • Around 58% higher clock speed: 2.3 GHz vs 1.46 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 40 nm
Maximum frequency 2.3 GHz vs 1.46 GHz
Manufacturing process technology 32 nm vs 40 nm

Compare benchmarks

CPU 1: VIA Nano QuadCore L4700
CPU 2: Intel Core i3-2350M

Name VIA Nano QuadCore L4700 Intel Core i3-2350M
PassMark - Single thread mark 970
PassMark - CPU mark 1256
Geekbench 4 - Single Core 386
Geekbench 4 - Multi-Core 848
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 1.442
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 26.392
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.177
CompuBench 1.5 Desktop - Video Composition (Frames/s) 0.689
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 1.665

Compare specifications (specs)

VIA Nano QuadCore L4700 Intel Core i3-2350M

Essentials

Architecture codename CNQ Sandy Bridge
Launch date 17 May 2011 15 May 2011
Place in performance rating not rated 3090
Series VIA Legacy Intel® Core™ Processors
Vertical segment Laptop Mobile
Launch price (MSRP) $225
Price now $41.97
Processor Number i3-2350M
Status Launched
Value for money (0-100) 18.37

Performance

64 bit support
Die size 132 mm 149 mm
Front-side bus (FSB) 1333 MHz
L1 cache 512 KB 128 KB
L2 cache 4 MB 512 KB
Manufacturing process technology 40 nm 32 nm
Maximum frequency 1.46 GHz 2.3 GHz
Number of cores 4 2
Number of threads 4 4
Base frequency 2.30 GHz
Bus Speed 5 GT/s DMI
L3 cache 3 MB
Maximum core temperature 85C (PGA); 100C (BGA)
Transistor count 624 Million

Compatibility

Sockets supported BGA PPGA988
Thermal Design Power (TDP) 27.5 Watt 35 Watt
Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 37.5mm x 37.5mm (rPGA988B); 31mm x 24mm (BGA1023)

Memory

Max memory channels 2
Maximum memory bandwidth 21.3 GB/s
Maximum memory size 16 GB
Supported memory types DDR3 1066/1333

Graphics

Device ID 0x116
Graphics base frequency 650 MHz
Graphics max dynamic frequency 1.15 GHz
Graphics max frequency 1.15 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel® HD Graphics 3000

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO
Wireless Display (WiDi) support

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

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