VIA Nano QuadCore L4700 vs Intel Core i3-2350M
Comparative analysis of VIA Nano QuadCore L4700 and Intel Core i3-2350M processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Graphics, Graphics interfaces, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the VIA Nano QuadCore L4700
- 2 more cores, run more applications at once: 4 vs 2
- 4x more L1 cache, more data can be stored in the L1 cache for quick access later
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 25% lower typical power consumption: 27.5 Watt vs 35 Watt
| Number of cores | 4 vs 2 |
| L1 cache | 512 KB vs 128 KB |
| L2 cache | 4 MB vs 512 KB |
| Thermal Design Power (TDP) | 27.5 Watt vs 35 Watt |
Reasons to consider the Intel Core i3-2350M
- Around 58% higher clock speed: 2.3 GHz vs 1.46 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 40 nm
| Maximum frequency | 2.3 GHz vs 1.46 GHz |
| Manufacturing process technology | 32 nm vs 40 nm |
Compare benchmarks
CPU 1: VIA Nano QuadCore L4700
CPU 2: Intel Core i3-2350M
| Name | VIA Nano QuadCore L4700 | Intel Core i3-2350M |
|---|---|---|
| PassMark - Single thread mark | 971 | |
| PassMark - CPU mark | 1256 | |
| Geekbench 4 - Single Core | 386 | |
| Geekbench 4 - Multi-Core | 848 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.442 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 26.392 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.177 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.689 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 1.665 |
Compare specifications (specs)
| VIA Nano QuadCore L4700 | Intel Core i3-2350M | |
|---|---|---|
Essentials |
||
| Architecture codename | CNQ | Sandy Bridge |
| Launch date | 17 May 2011 | 15 May 2011 |
| Place in performance rating | not rated | 3100 |
| Series | VIA | Legacy Intel® Core™ Processors |
| Vertical segment | Laptop | Mobile |
| Launch price (MSRP) | $225 | |
| Price now | $41.97 | |
| Processor Number | i3-2350M | |
| Status | Launched | |
| Value for money (0-100) | 18.37 | |
Performance |
||
| 64 bit support | ||
| Die size | 132 mm | 149 mm |
| Front-side bus (FSB) | 1333 MHz | |
| L1 cache | 512 KB | 128 KB |
| L2 cache | 4 MB | 512 KB |
| Manufacturing process technology | 40 nm | 32 nm |
| Maximum frequency | 1.46 GHz | 2.3 GHz |
| Number of cores | 4 | 2 |
| Number of threads | 4 | 4 |
| Base frequency | 2.30 GHz | |
| Bus Speed | 5 GT/s DMI | |
| L3 cache | 3 MB | |
| Maximum core temperature | 85C (PGA); 100C (BGA) | |
| Transistor count | 624 Million | |
Compatibility |
||
| Sockets supported | BGA | PPGA988 |
| Thermal Design Power (TDP) | 27.5 Watt | 35 Watt |
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 37.5mm x 37.5mm (rPGA988B); 31mm x 24mm (BGA1023) | |
Memory |
||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 21.3 GB/s | |
| Maximum memory size | 16 GB | |
| Supported memory types | DDR3 1066/1333 | |
Graphics |
||
| Device ID | 0x116 | |
| Graphics base frequency | 650 MHz | |
| Graphics max dynamic frequency | 1.15 GHz | |
| Graphics max frequency | 1.15 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel® HD Graphics 3000 | |
Graphics interfaces |
||
| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 2 | |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Peripherals |
||
| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
||
| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| 4G WiMAX Wireless | ||
| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||