AMD FirePro S9300 X2 vs NVIDIA GeForce FX Go5650

Comparative analysis of AMD FirePro S9300 X2 and NVIDIA GeForce FX Go5650 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: Geekbench - OpenCL, PassMark - G3D Mark, PassMark - G2D Mark.

AMD FirePro S9300 X2

NVIDIA GeForce FX Go5650

Differences

Reasons to consider the AMD FirePro S9300 X2

Videocard is newer: launch date 13 year(s) 1 month(s) later
2.6x more core clock speed: 850 MHz vs 325 MHz
1705.8x more texture fill rate: 2x 217.6 GTexel / s billion / sec vs 1.3 GTexel / s
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 28 nm vs 130 nm
64x more maximum memory size: 2x 4 GB vs 128 MB
Around 69% higher memory clock speed: 1000 MHz vs 590 MHz

Launch date	31 March 2016 vs 1 March 2003
Core clock speed	850 MHz vs 325 MHz
Texture fill rate	2x 217.6 GTexel / s billion / sec vs 1.3 GTexel / s
Manufacturing process technology	28 nm vs 130 nm
Maximum memory size	2x 4 GB vs 128 MB
Memory clock speed	1000 MHz vs 590 MHz

Compare benchmarks

GPU 1: AMD FirePro S9300 X2
GPU 2: NVIDIA GeForce FX Go5650

Name	AMD FirePro S9300 X2	NVIDIA GeForce FX Go5650
Geekbench - OpenCL	27971
PassMark - G3D Mark		17
PassMark - G2D Mark		211

Compare specifications (specs)

	AMD FirePro S9300 X2	NVIDIA GeForce FX Go5650
Essentials
Architecture	GCN 3.0	Rankine
Code name	Capsaicin	NV31 A1
Launch date	31 March 2016	1 March 2003
Launch price (MSRP)	$5,999
Place in performance rating	852	840
Type	Workstation	Desktop
Technical info
Core clock speed	850 MHz	325 MHz
Floating-point performance	2x 6,963 gflops
Manufacturing process technology	28 nm	130 nm
Pipelines	2x 4096
Texture fill rate	2x 217.6 GTexel / s billion / sec	1.3 GTexel / s
Thermal Design Power (TDP)	300 Watt
Transistor count	8,900 million	80 million
Video outputs and ports
Display Connectors	No outputs	No outputs
Compatibility, dimensions and requirements
Interface	PCIe 3.0 x16	AGP 8x
Length	267 mm
Supplementary power connectors	2x 8-pin
API support
DirectX	12.0 (12_0)	9.0a
OpenGL	4.5	1.5 (2.1)
Memory
Maximum RAM amount	2x 4 GB	128 MB
Memory bandwidth	2x 512.0 GB / s	9.44 GB / s
Memory bus width	2x 4096 Bit	128 Bit
Memory clock speed	1000 MHz	590 MHz
Memory type	HBM	DDR