AMD Radeon 530X vs AMD FirePro S9300 X2

Comparative analysis of AMD Radeon 530X and AMD FirePro S9300 X2 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, Memory, API support. Benchmark videocards performance analysis: Geekbench - OpenCL.

AMD Radeon 530X

AMD FirePro S9300 X2

Differences

Reasons to consider the AMD Radeon 530X

Videocard is newer: launch date 1 year(s) 0 month(s) later
6x lower typical power consumption: 50 Watt vs 300 Watt
4x more memory clock speed: 4000 MHz vs 1000 MHz

Specifications (specs)
Launch date	18 April 2017 vs 31 March 2016
Thermal Design Power (TDP)	50 Watt vs 300 Watt
Memory clock speed	4000 MHz vs 1000 MHz
Benchmarks
Geekbench - OpenCL	28019 vs 27971

Reasons to consider the AMD FirePro S9300 X2

Around 16% higher core clock speed: 850 MHz vs 730 MHz
90.5x more texture fill rate: 2x 217.6 GTexel / s billion / sec vs 24.5 GTexel / s
21.3x more pipelines: 2x 4096 vs 384
17.8x better floating-point performance: 2x 6,963 gflops vs 784.1 gflops
4x more maximum memory size: 2x 4 GB vs 2 GB

Core clock speed	850 MHz vs 730 MHz
Texture fill rate	2x 217.6 GTexel / s billion / sec vs 24.5 GTexel / s
Pipelines	2x 4096 vs 384
Floating-point performance	2x 6,963 gflops vs 784.1 gflops
Maximum memory size	2x 4 GB vs 2 GB

Compare benchmarks

GPU 1: AMD Radeon 530X
GPU 2: AMD FirePro S9300 X2

Geekbench - OpenCL

GPU 1

GPU 2

28019

27971

Name	AMD Radeon 530X	AMD FirePro S9300 X2
Geekbench - OpenCL	28019	27971

Compare specifications (specs)

	AMD Radeon 530X	AMD FirePro S9300 X2
Essentials
Architecture	GCN 1.0	GCN 3.0
Code name	Meso	Capsaicin
Launch date	18 April 2017	31 March 2016
Place in performance rating	804	805
Type	Desktop	Workstation
Launch price (MSRP)		$5,999
Technical info
Boost clock speed	1021 MHz
Core clock speed	730 MHz	850 MHz
Floating-point performance	784.1 gflops	2x 6,963 gflops
Manufacturing process technology	28 nm	28 nm
Pipelines	384	2x 4096
Texture fill rate	24.5 GTexel / s	2x 217.6 GTexel / s billion / sec
Thermal Design Power (TDP)	50 Watt	300 Watt
Transistor count	1,040 million	8,900 million
Video outputs and ports
Display Connectors	1x DVI, 1x HDMI, 1x VGA	No outputs
Compatibility, dimensions and requirements
Interface	PCIe 3.0 x8	PCIe 3.0 x16
Supplementary power connectors	None	2x 8-pin
Length		267 mm
Memory
Maximum RAM amount	2 GB	2x 4 GB
Memory bandwidth	32 GB / s	2x 512.0 GB / s
Memory bus width	64 Bit	2x 4096 Bit
Memory clock speed	4000 MHz	1000 MHz
Memory type	GDDR5	HBM
API support
DirectX		12.0 (12_0)
OpenGL		4.5