AMD FirePro S9300 X2 vs NVIDIA GeForce Go 6800

Comparative analysis of AMD FirePro S9300 X2 and NVIDIA GeForce Go 6800 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: Geekbench - OpenCL, PassMark - G3D Mark, PassMark - G2D Mark.

AMD FirePro S9300 X2

NVIDIA GeForce Go 6800

Differences

Reasons to consider the AMD FirePro S9300 X2

Videocard is newer: launch date 11 year(s) 4 month(s) later
2.8x more core clock speed: 850 MHz vs 300 MHz
616x more texture fill rate: 2x 217.6 GTexel / s billion / sec vs 3.6 GTexel / s
682.7x more pipelines: 2x 4096 vs 12
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 28 nm vs 130 nm
32x more maximum memory size: 2x 4 GB vs 256 MB

Launch date	31 March 2016 vs 8 November 2004
Core clock speed	850 MHz vs 300 MHz
Texture fill rate	2x 217.6 GTexel / s billion / sec vs 3.6 GTexel / s
Pipelines	2x 4096 vs 12
Manufacturing process technology	28 nm vs 130 nm
Maximum memory size	2x 4 GB vs 256 MB

Reasons to consider the NVIDIA GeForce Go 6800

6.7x lower typical power consumption: 45 Watt vs 300 Watt
Around 10% higher memory clock speed: 1100 MHz vs 1000 MHz

Thermal Design Power (TDP)	45 Watt vs 300 Watt
Memory clock speed	1100 MHz vs 1000 MHz

Compare benchmarks

GPU 1: AMD FirePro S9300 X2
GPU 2: NVIDIA GeForce Go 6800

Name	AMD FirePro S9300 X2	NVIDIA GeForce Go 6800
Geekbench - OpenCL	27971
PassMark - G3D Mark		106
PassMark - G2D Mark		205

Compare specifications (specs)

	AMD FirePro S9300 X2	NVIDIA GeForce Go 6800
Essentials
Architecture	GCN 3.0	Curie
Code name	Capsaicin	NV41
Launch date	31 March 2016	8 November 2004
Launch price (MSRP)	$5,999
Place in performance rating	852	849
Type	Workstation	Laptop
Technical info
Core clock speed	850 MHz	300 MHz
Floating-point performance	2x 6,963 gflops
Manufacturing process technology	28 nm	130 nm
Pipelines	2x 4096	12
Texture fill rate	2x 217.6 GTexel / s billion / sec	3.6 GTexel / s
Thermal Design Power (TDP)	300 Watt	45 Watt
Transistor count	8,900 million	222 million
Boost clock speed		300 MHz
Video outputs and ports
Display Connectors	No outputs	No outputs
Compatibility, dimensions and requirements
Interface	PCIe 3.0 x16	MXM-III
Length	267 mm
Supplementary power connectors	2x 8-pin	None
Laptop size		large
API support
DirectX	12.0 (12_0)	9.0c
OpenGL	4.5	2.1
Memory
Maximum RAM amount	2x 4 GB	256 MB
Memory bandwidth	2x 512.0 GB / s	35.2 GB / s
Memory bus width	2x 4096 Bit	300 Bit
Memory clock speed	1000 MHz	1100 MHz
Memory type	HBM	128 / 256
Shared memory		0