AMD FirePro S9300 X2 vs AMD Radeon HD 8650D IGP

Comparative analysis of AMD FirePro S9300 X2 and AMD Radeon HD 8650D IGP videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: Geekbench - OpenCL, PassMark - G3D Mark, PassMark - G2D Mark.

AMD FirePro S9300 X2

AMD Radeon HD 8650D IGP

Differences

Reasons to consider the AMD FirePro S9300 X2

Videocard is newer: launch date 2 year(s) 3 month(s) later
Around 18% higher core clock speed: 850 MHz vs 720 MHz
109.5x more texture fill rate: 2x 217.6 GTexel / s billion / sec vs 20.26 GTexel / s
21.3x more pipelines: 2x 4096 vs 384
21.5x better floating-point performance: 2x 6,963 gflops vs 648.2 gflops
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 28 nm vs 32 nm
2.7x better performance in Geekbench - OpenCL: 27971 vs 10204

Specifications (specs)
Launch date	31 March 2016 vs 28 December 2013
Core clock speed	850 MHz vs 720 MHz
Texture fill rate	2x 217.6 GTexel / s billion / sec vs 20.26 GTexel / s
Pipelines	2x 4096 vs 384
Floating-point performance	2x 6,963 gflops vs 648.2 gflops
Manufacturing process technology	28 nm vs 32 nm
Benchmarks
Geekbench - OpenCL	27971 vs 10204

Reasons to consider the AMD Radeon HD 8650D IGP

4.6x lower typical power consumption: 65 Watt vs 300 Watt

Thermal Design Power (TDP)	65 Watt vs 300 Watt

Compare benchmarks

GPU 1: AMD FirePro S9300 X2
GPU 2: AMD Radeon HD 8650D IGP

Geekbench - OpenCL

GPU 1

GPU 2

27971

10204

Name	AMD FirePro S9300 X2	AMD Radeon HD 8650D IGP
Geekbench - OpenCL	27971	10204
PassMark - G3D Mark		396
PassMark - G2D Mark		259

Compare specifications (specs)

	AMD FirePro S9300 X2	AMD Radeon HD 8650D IGP
Essentials
Architecture	GCN 3.0	TeraScale 3
Code name	Capsaicin	Scrapper
Launch date	31 March 2016	28 December 2013
Launch price (MSRP)	$5,999
Place in performance rating	852	853
Type	Workstation	Desktop
Technical info
Core clock speed	850 MHz	720 MHz
Floating-point performance	2x 6,963 gflops	648.2 gflops
Manufacturing process technology	28 nm	32 nm
Pipelines	2x 4096	384
Texture fill rate	2x 217.6 GTexel / s billion / sec	20.26 GTexel / s
Thermal Design Power (TDP)	300 Watt	65 Watt
Transistor count	8,900 million	1,303 million
Boost clock speed		844 MHz
Video outputs and ports
Display Connectors	No outputs	No outputs
Compatibility, dimensions and requirements
Interface	PCIe 3.0 x16	IGP
Length	267 mm
Supplementary power connectors	2x 8-pin
API support
DirectX	12.0 (12_0)	11.2 (11_0)
OpenGL	4.5	4.4
Memory
Maximum RAM amount	2x 4 GB
Memory bandwidth	2x 512.0 GB / s
Memory bus width	2x 4096 Bit
Memory clock speed	1000 MHz
Memory type	HBM	System Shared