AMD Radeon HD 8350 OEM vs ATI Radeon X850 PRO

Comparative analysis of AMD Radeon HD 8350 OEM and ATI Radeon X850 PRO videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G2D Mark, PassMark - G3D Mark, Geekbench - OpenCL.

 

Differences

Reasons to consider the AMD Radeon HD 8350 OEM

  • Videocard is newer: launch date 8 year(s) 1 month(s) later
  • Around 28% higher core clock speed: 650 MHz vs 507 MHz
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 130 nm
  • 4x more maximum memory size: 1 GB vs 256 MB
  • Around 28% higher memory clock speed: 1334 MHz vs 1040 MHz
  • Around 41% better performance in PassMark - G2D Mark: 222 vs 157
  • 2.2x better performance in PassMark - G3D Mark: 163 vs 73
Specifications (specs)
Launch date 8 January 2013 vs 1 December 2004
Core clock speed 650 MHz vs 507 MHz
Manufacturing process technology 40 nm vs 130 nm
Maximum memory size 1 GB vs 256 MB
Memory clock speed 1334 MHz vs 1040 MHz
Benchmarks
PassMark - G2D Mark 222 vs 157
PassMark - G3D Mark 163 vs 73

Reasons to consider the ATI Radeon X850 PRO

  • Around 17% higher texture fill rate: 6.08 GTexel / s vs 5.2 GTexel / s
Texture fill rate 6.08 GTexel / s vs 5.2 GTexel / s

Compare benchmarks

GPU 1: AMD Radeon HD 8350 OEM
GPU 2: ATI Radeon X850 PRO

PassMark - G2D Mark
GPU 1
GPU 2
222
157
PassMark - G3D Mark
GPU 1
GPU 2
163
73
Name AMD Radeon HD 8350 OEM ATI Radeon X850 PRO
PassMark - G2D Mark 222 157
PassMark - G3D Mark 163 73
Geekbench - OpenCL 2883

Compare specifications (specs)

AMD Radeon HD 8350 OEM ATI Radeon X850 PRO

Essentials

Architecture TeraScale 2 R400
Code name Cedar R480
Launch date 8 January 2013 1 December 2004
Place in performance rating 1067 1064
Type Desktop Desktop
Launch price (MSRP) $279

Technical info

Core clock speed 650 MHz 507 MHz
Floating-point performance 104.0 gflops
Manufacturing process technology 40 nm 130 nm
Pipelines 80
Texture fill rate 5.2 GTexel / s 6.08 GTexel / s
Thermal Design Power (TDP) 19 Watt
Transistor count 292 million 160 million

Video outputs and ports

Display Connectors 1x DVI, 1x HDMI 1x DVI, 1x VGA, 1x S-Video

Compatibility, dimensions and requirements

Interface PCIe 2.0 x16 PCIe 1.0 x16
Length 168 mm
Supplementary power connectors None 1x 6-pin

API support

DirectX 11.2 9.0b
OpenGL 4.4 2.0

Memory

Maximum RAM amount 1 GB 256 MB
Memory bandwidth 10.67 GB / s 33.3 GB / s
Memory bus width 64 Bit 256 Bit
Memory clock speed 1334 MHz 1040 MHz
Memory type DDR3 GDDR3