AMD Radeon HD 8970 OEM vs ATI Radeon X600 SE

Comparative analysis of AMD Radeon HD 8970 OEM and ATI Radeon X600 SE videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps), PassMark - G2D Mark, PassMark - G3D Mark.

AMD Radeon HD 8970 OEM

ATI Radeon X600 SE

Differences

Reasons to consider the AMD Radeon HD 8970 OEM

Videocard is newer: launch date 8 year(s) 4 month(s) later
2.8x more core clock speed: 925 MHz vs 325 MHz
91.1x more texture fill rate: 118.4 GTexel / s vs 1.3 GTexel / s
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 28 nm vs 110 nm
24x more maximum memory size: 3 GB vs 128 MB
11x more memory clock speed: 5500 MHz vs 500 MHz

Launch date	8 January 2013 vs 1 September 2004
Core clock speed	925 MHz vs 325 MHz
Texture fill rate	118.4 GTexel / s vs 1.3 GTexel / s
Manufacturing process technology	28 nm vs 110 nm
Maximum memory size	3 GB vs 128 MB
Memory clock speed	5500 MHz vs 500 MHz

Reasons to consider the ATI Radeon X600 SE

6.9x lower typical power consumption: 36 Watt vs 250 Watt

Thermal Design Power (TDP)	36 Watt vs 250 Watt

Compare benchmarks

GPU 1: AMD Radeon HD 8970 OEM
GPU 2: ATI Radeon X600 SE

Name	AMD Radeon HD 8970 OEM	ATI Radeon X600 SE
GFXBench 4.0 - Manhattan (Frames)	3583
GFXBench 4.0 - Manhattan (Fps)	3583
GFXBench 4.0 - T-Rex (Frames)	3339
GFXBench 4.0 - T-Rex (Fps)	3339
PassMark - G2D Mark		229
PassMark - G3D Mark		49

Compare specifications (specs)

	AMD Radeon HD 8970 OEM	ATI Radeon X600 SE
Essentials
Architecture	GCN 1.0	Rage 9
Code name	Tahiti	RV370
Launch date	8 January 2013	1 September 2004
Place in performance rating	757	760
Type	Desktop	Desktop
Technical info
Core clock speed	925 MHz	325 MHz
Floating-point performance	3,789 gflops
Manufacturing process technology	28 nm	110 nm
Pipelines	2048
Texture fill rate	118.4 GTexel / s	1.3 GTexel / s
Thermal Design Power (TDP)	250 Watt	36 Watt
Transistor count	4,313 million	107 million
Video outputs and ports
Display Connectors	1x DVI, 1x HDMI, 2x mini-DisplayPort	1x DVI, 1x S-Video
Compatibility, dimensions and requirements
Interface	PCIe 3.0 x16	PCIe 1.0 x16
Length	274 mm
Supplementary power connectors	1x 6-pin + 1x 8-pin	None
API support
DirectX	12.0	9.0
OpenGL	4.5	2.0
Memory
Maximum RAM amount	3 GB	128 MB
Memory bandwidth	264.0 GB / s	4 GB / s
Memory bus width	384 Bit	64 Bit
Memory clock speed	5500 MHz	500 MHz
Memory type	GDDR5	DDR