AMD Radeon RX Vega 64 Liquid vs ATI FirePro RG220

Comparative analysis of AMD Radeon RX Vega 64 Liquid and ATI FirePro RG220 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, Memory, API support. Benchmark videocards performance analysis: 3DMark Fire Strike - Graphics Score, PassMark - G2D Mark, PassMark - G3D Mark.

 

Differences

Reasons to consider the AMD Radeon RX Vega 64 Liquid

  • Videocard is newer: launch date 9 year(s) 3 month(s) later
  • 2.8x more core clock speed: 1406 MHz vs 500 MHz
  • 107.3x more texture fill rate: 429.3 GTexel / s vs 4 GTexel / s
  • 51.2x more pipelines: 4096 vs 80
  • 171.7x better floating-point performance: 13,738 gflops vs 80 gflops
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 14 nm vs 55 nm
  • 16x more maximum memory size: 8 GB vs 512 MB
  • Around 18% higher memory clock speed: 1890 MHz vs 1600 MHz
Launch date 8 August 2017 vs 1 May 2008
Core clock speed 1406 MHz vs 500 MHz
Texture fill rate 429.3 GTexel / s vs 4 GTexel / s
Pipelines 4096 vs 80
Floating-point performance 13,738 gflops vs 80 gflops
Manufacturing process technology 14 nm vs 55 nm
Maximum memory size 8 GB vs 512 MB
Memory clock speed 1890 MHz vs 1600 MHz

Reasons to consider the ATI FirePro RG220

  • 6.4x lower typical power consumption: 35 Watt vs 225 Watt
Thermal Design Power (TDP) 35 Watt vs 225 Watt

Compare benchmarks

GPU 1: AMD Radeon RX Vega 64 Liquid
GPU 2: ATI FirePro RG220

Name AMD Radeon RX Vega 64 Liquid ATI FirePro RG220
3DMark Fire Strike - Graphics Score 7765
PassMark - G2D Mark 552
PassMark - G3D Mark 335

Compare specifications (specs)

AMD Radeon RX Vega 64 Liquid ATI FirePro RG220

Essentials

Architecture GCN 5.0 TeraScale
Code name Vega 10 RV711
Launch date 8 August 2017 1 May 2008
Place in performance rating 256 251
Type Desktop Workstation

Technical info

Boost clock speed 1677 MHz
Core clock speed 1406 MHz 500 MHz
Floating-point performance 13,738 gflops 80 gflops
Manufacturing process technology 14 nm 55 nm
Pipelines 4096 80
Texture fill rate 429.3 GTexel / s 4 GTexel / s
Thermal Design Power (TDP) 225 Watt 35 Watt
Transistor count 242 million

Video outputs and ports

Display Connectors 1x HDMI, 3x DisplayPort 1x DMS-59

Compatibility, dimensions and requirements

Interface PCIe 3.0 x16 PCIe 2.0 x16
Length 267 mm
Supplementary power connectors 2x 8-pin None

Memory

Maximum RAM amount 8 GB 512 MB
Memory bandwidth 483.8 GB / s 51.2 GB / s
Memory bus width 2048 Bit 256 Bit
Memory clock speed 1890 MHz 1600 MHz
Memory type HBM2 GDDR3

API support

DirectX 10.1
OpenGL 3.3