ATI Radeon HD 4450 vs AMD Radeon HD 6370D IGP

Comparative analysis of ATI Radeon HD 4450 and AMD Radeon HD 6370D IGP videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, Geekbench - OpenCL, GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

ATI Radeon HD 4450

AMD Radeon HD 6370D IGP

Differences

Reasons to consider the ATI Radeon HD 4450

Around 35% higher core clock speed: 600 MHz vs 443 MHz
Around 36% higher texture fill rate: 4.8 GTexel / s vs 3.54 GTexel / s
2.6x lower typical power consumption: 25 Watt vs 65 Watt

Core clock speed	600 MHz vs 443 MHz
Texture fill rate	4.8 GTexel / s vs 3.54 GTexel / s
Thermal Design Power (TDP)	25 Watt vs 65 Watt

Reasons to consider the AMD Radeon HD 6370D IGP

2x more pipelines: 160 vs 80
Around 48% better floating-point performance: 141.76 gflops vs 96 gflops
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 32 nm vs 55 nm

Pipelines	160 vs 80
Floating-point performance	141.76 gflops vs 96 gflops
Manufacturing process technology	32 nm vs 55 nm

Compare benchmarks

GPU 1: ATI Radeon HD 4450
GPU 2: AMD Radeon HD 6370D IGP

Name	ATI Radeon HD 4450	AMD Radeon HD 6370D IGP
PassMark - G3D Mark		254
PassMark - G2D Mark		147
Geekbench - OpenCL		3253
GFXBench 4.0 - Manhattan (Frames)		873
GFXBench 4.0 - Manhattan (Fps)		873
GFXBench 4.0 - T-Rex (Frames)		1434
GFXBench 4.0 - T-Rex (Fps)		1434

Compare specifications (specs)

	ATI Radeon HD 4450	AMD Radeon HD 6370D IGP
Essentials
Architecture	TeraScale	TeraScale 2
Code name	RV710	WinterPark
Launch date	18 November 2011	1 November 2011
Place in performance rating	not rated	1442
Type	Desktop	Desktop
Technical info
Core clock speed	600 MHz	443 MHz
Floating-point performance	96 gflops	141.76 gflops
Manufacturing process technology	55 nm	32 nm
Pipelines	80	160
Texture fill rate	4.8 GTexel / s	3.54 GTexel / s
Thermal Design Power (TDP)	25 Watt	65 Watt
Transistor count	242 million	1,180 million
Video outputs and ports
Display Connectors	1x DVI, 1x HDMI, 1x DisplayPort	No outputs
Compatibility, dimensions and requirements
Interface	PCIe 2.0 x16	IGP
Length	168 mm
Supplementary power connectors	None
API support
DirectX	10.1	11.2 (11_0)
OpenGL	3.3	4.4
Memory
Maximum RAM amount	512 MB
Memory bandwidth	6.4 GB / s
Memory bus width	64 Bit
Memory clock speed	800 MHz
Memory type	DDR2	System Shared