ATI Radeon X1050 vs NVIDIA GeForce Go 7900 GTX

Comparative analysis of ATI Radeon X1050 and NVIDIA GeForce Go 7900 GTX videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark.

 

Differences

Reasons to consider the ATI Radeon X1050

  • Videocard is newer: launch date 7 month(s) later
  • Around 88% lower typical power consumption: 24 Watt vs 45 Watt
Launch date 7 December 2006 vs 18 April 2006
Thermal Design Power (TDP) 24 Watt vs 45 Watt

Reasons to consider the NVIDIA GeForce Go 7900 GTX

  • Around 25% higher core clock speed: 500 MHz vs 400 MHz
  • 7.5x more texture fill rate: 12 GTexel / s vs 1.6 GTexel / s
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 90 nm vs 110 nm
  • 4x more maximum memory size: 512 MB vs 128 MB
  • Around 80% higher memory clock speed: 1200 MHz vs 666 MHz
  • 5.5x better performance in PassMark - G3D Mark: 270 vs 49
  • Around 8% better performance in PassMark - G2D Mark: 264 vs 245
Specifications (specs)
Core clock speed 500 MHz vs 400 MHz
Texture fill rate 12 GTexel / s vs 1.6 GTexel / s
Manufacturing process technology 90 nm vs 110 nm
Maximum memory size 512 MB vs 128 MB
Memory clock speed 1200 MHz vs 666 MHz
Benchmarks
PassMark - G3D Mark 270 vs 49
PassMark - G2D Mark 264 vs 245

Compare benchmarks

GPU 1: ATI Radeon X1050
GPU 2: NVIDIA GeForce Go 7900 GTX

PassMark - G3D Mark
GPU 1
GPU 2
49
270
PassMark - G2D Mark
GPU 1
GPU 2
245
264
Name ATI Radeon X1050 NVIDIA GeForce Go 7900 GTX
PassMark - G3D Mark 49 270
PassMark - G2D Mark 245 264

Compare specifications (specs)

ATI Radeon X1050 NVIDIA GeForce Go 7900 GTX

Essentials

Architecture Rage 9 Curie
Code name RV370 G71
Launch date 7 December 2006 18 April 2006
Place in performance rating 745 651
Type Desktop Laptop

Technical info

Core clock speed 400 MHz 500 MHz
Manufacturing process technology 110 nm 90 nm
Texture fill rate 1.6 GTexel / s 12 GTexel / s
Thermal Design Power (TDP) 24 Watt 45 Watt
Transistor count 107 million 278 million
Boost clock speed 500 MHz
Pipelines 24

Video outputs and ports

Display Connectors 1x DVI, 1x VGA, 1x S-Video No outputs

Compatibility, dimensions and requirements

Interface PCIe 1.0 x16 PCIe 1.0 x16
Supplementary power connectors None None
Laptop size large

API support

DirectX 9.0 9.0c
OpenGL 2.0 2.1

Memory

Maximum RAM amount 128 MB 512 MB
Memory bandwidth 5.33 GB / s 38.4 GB / s
Memory bus width 64 Bit 600 Bit
Memory clock speed 666 MHz 1200 MHz
Memory type DDR2 256
Shared memory 0