| Architektur Codename |
Skylake |
Broadwell |
| Startdatum |
Q4'15 |
1 December 2014 |
| Platz in der Leistungsbewertung |
2170 |
2157 |
| Prozessornummer |
i3-6102E |
5Y51 |
| Serie |
6th Generation Intel® Core™ i3 Processors |
5th Generation Intel® Core™ M Processors |
| Status |
Launched |
Launched |
| Vertikales Segment |
Embedded |
Mobile |
| 64-Bit-Unterstützung |
|
|
| Basistaktfrequenz |
1.90 GHz |
1.10 GHz |
| Bus Speed |
8 GT/s DMI3 |
|
| Fertigungsprozesstechnik |
14 nm |
14 nm |
| Maximale Kerntemperatur |
100°C |
95 °C |
| Anzahl der Adern |
2 |
2 |
| Anzahl der Gewinde |
4 |
4 |
| Matrizengröße |
|
82 mm |
| L1 Cache |
|
128 KB |
| L2 Cache |
|
512 KB |
| L3 Cache |
|
4 MB |
| Maximale Frequenz |
|
2.60 GHz |
| Anzahl der Transistoren |
|
1300 Million |
| Maximale Speicherkanäle |
2 |
2 |
| Maximale Speicherbandbreite |
34.1 GB/s |
25.6 GB/s |
| Maximale Speichergröße |
64 GB |
16 GB |
| Unterstützte Speichertypen |
DDR4-2133, LPDDR3-1866, DDR3L-1600 |
LPDDR3 1333/1600; DDR3L/DDR3L-RS 1600 |
| Device ID |
0x191B |
0x161E |
| Graphics base frequency |
350 MHz |
300 MHz |
| Graphics max dynamic frequency |
950 MHz |
900 MHz |
| Intel® Clear Video HD Technologie |
|
|
| Intel® Clear Video Technologie |
|
|
| Intel® InTru™ 3D-Technologie |
|
|
| Intel® Quick Sync Video |
|
|
| Maximaler Videospeicher |
64 GB |
16 GB |
| Prozessorgrafiken |
Intel® HD Graphics 530 |
Intel® HD Graphics 5300 |
| Grafik Maximalfrequenz |
|
900 MHz |
| Intel® Flexible Display Interface (Intel® FDI) |
|
|
| DisplayPort |
|
|
| DVI |
|
|
| eDP |
|
|
| HDMI |
|
|
| Anzahl der unterstützten Anzeigen |
3 |
3 |
| Unterstützung für Wireless Display (WiDi) |
|
|
| Unterstützung von 4K-Auflösungen |
|
|
| Maximale Auflösung über DisplayPort |
4096x2304@60Hz |
2560x1600@60Hz |
| Maximale Auflösung über eDP |
4096x2304@60Hz |
|
| Maximale Auflösung über HDMI 1.4 |
4096x2304@24Hz |
2560x1600@60Hz |
| DirectX |
12 |
11.2/12 |
| OpenGL |
4.5 |
4.3 |
| Low Halogen Options Available |
|
|
| Maximale Anzahl von CPUs in einer Konfiguration |
1 |
1 |
| Gehäusegröße |
42mm x 28mm |
30mm x 16.5mm |
| Unterstützte Sockel |
FCBGA1440 |
FCBGA1234 |
| Thermische Designleistung (TDP) |
25 Watt |
4.5 Watt |
| Configurable TDP-down |
|
3.5 W |
| Configurable TDP-down Frequency |
|
600 MHz |
| Configurable TDP-up |
|
6 W |
| Configurable TDP-up Frequency |
|
1.30 GHz |
| Scenario Design Power (SDP) |
|
3.5 W |
| Maximale Anzahl von PCIe-Strecken |
16 |
12 |
| PCI Express Revision |
3.0 |
2.0 |
| PCIe configurations |
Up to 1x16, 2x8, 1x8+2x4 |
x1 (6), x2 (4), x4 (3) |
| Execute Disable Bit (EDB) |
|
|
| Intel® Identity Protection Technologie |
|
|
| Intel® Memory Protection Extensions (Intel® MPX) |
|
|
| Intel® OS Guard |
|
|
| Intel® Secure Key Technologie |
|
|
| Intel® Software Guard Extensions (Intel® SGX) |
|
|
| Intel® Trusted Execution Technologie (TXT) |
|
|
| Secure Boot |
|
|
| Enhanced Intel SpeedStep® Technologie |
|
|
| Idle States |
|
|
| Befehlssatzerweiterungen |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| Intel 64 |
|
|
| Intel® AES New Instructions |
|
|
| Intel® Hyper-Threading Technologie |
|
|
| Intel® TSX-NI |
|
|
| Intel® Turbo Boost Technologie |
|
|
| Intel® vPro™ Plattform-Berechtigung |
|
|
| Thermal Monitoring |
|
|
| Flexible Display interface (FDI) |
|
|
| Intel® Advanced Vector Extensions (AVX) |
|
|
| Intel® Fast Memory Access |
|
|
| Intel® Flex Memory Access |
|
|
| Intel® Smart Response Technologie |
|
|
| Intel® Stable Image Platform Program (SIPP) |
|
|
| Intel® Virtualization Technology (VT-x) |
|
|
| Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
| Intel® VT-x with Extended Page Tables (EPT) |
|
|
| AMD Virtualization (AMD-V™) |
|
|