Intel Core i3-6102E vs Intel Core M-5Y51

Comparative analysis of Intel Core i3-6102E and Intel Core M-5Y51 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).

Intel Core i3-6102E

Intel Core M-5Y51

Differences

Reasons to consider the Intel Core i3-6102E

Around 5% higher maximum core temperature: 100°C vs 95 °C
4x more maximum memory size: 64 GB vs 16 GB
Around 17% better performance in PassMark - CPU mark: 2349 vs 2010

Specifications (specs)
Maximum core temperature	100°C vs 95 °C
Maximum memory size	64 GB vs 16 GB
Benchmarks
PassMark - CPU mark	2349 vs 2010

Reasons to consider the Intel Core M-5Y51

5x lower typical power consumption: 4.5 Watt vs 25 Watt
Around 22% better performance in PassMark - Single thread mark: 1305 vs 1068

Specifications (specs)
Thermal Design Power (TDP)	4.5 Watt vs 25 Watt
Benchmarks
PassMark - Single thread mark	1305 vs 1068

Compare benchmarks

CPU 1: Intel Core i3-6102E
CPU 2: Intel Core M-5Y51

PassMark - Single thread mark

CPU 1

CPU 2

1068

1305

PassMark - CPU mark

CPU 1

CPU 2

2349

2010

Name	Intel Core i3-6102E	Intel Core M-5Y51
PassMark - Single thread mark	1068	1305
PassMark - CPU mark	2349	2010
Geekbench 4 - Single Core		462
Geekbench 4 - Multi-Core		830
GFXBench 4.0 - Car Chase Offscreen (Frames)		560
GFXBench 4.0 - Manhattan (Frames)		1304
GFXBench 4.0 - T-Rex (Frames)		1954
GFXBench 4.0 - Car Chase Offscreen (Fps)		560
GFXBench 4.0 - Manhattan (Fps)		1304
GFXBench 4.0 - T-Rex (Fps)		1954

Compare specifications (specs)

	Intel Core i3-6102E	Intel Core M-5Y51
Essentials
Architecture codename	Skylake	Broadwell
Launch date	Q4'15	1 December 2014
Place in performance rating	2170	2161
Processor Number	i3-6102E	5Y51
Series	6th Generation Intel® Core™ i3 Processors	5th Generation Intel® Core™ M Processors
Status	Launched	Launched
Vertical segment	Embedded	Mobile
Performance
64 bit support
Base frequency	1.90 GHz	1.10 GHz
Bus Speed	8 GT/s DMI3
Manufacturing process technology	14 nm	14 nm
Maximum core temperature	100°C	95 °C
Number of cores	2	2
Number of threads	4	4
Die size		82 mm
L1 cache		128 KB
L2 cache		512 KB
L3 cache		4 MB
Maximum frequency		2.60 GHz
Transistor count		1300 Million
Memory
Max memory channels	2	2
Maximum memory bandwidth	34.1 GB/s	25.6 GB/s
Maximum memory size	64 GB	16 GB
Supported memory types	DDR4-2133, LPDDR3-1866, DDR3L-1600	LPDDR3 1333/1600; DDR3L/DDR3L-RS 1600
Graphics
Device ID	0x191B	0x161E
Graphics base frequency	350 MHz	300 MHz
Graphics max dynamic frequency	950 MHz	900 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory	64 GB	16 GB
Processor graphics	Intel® HD Graphics 530	Intel® HD Graphics 5300
Graphics max frequency		900 MHz
Intel® Flexible Display Interface (Intel® FDI)
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3	3
Wireless Display (WiDi) support
Graphics image quality
4K resolution support
Max resolution over DisplayPort	4096x2304@60Hz	2560x1600@60Hz
Max resolution over eDP	4096x2304@60Hz
Max resolution over HDMI 1.4	4096x2304@24Hz	2560x1600@60Hz
Graphics API support
DirectX	12	11.2/12
OpenGL	4.5	4.3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	42mm x 28mm	30mm x 16.5mm
Sockets supported	FCBGA1440	FCBGA1234
Thermal Design Power (TDP)	25 Watt	4.5 Watt
Configurable TDP-down		3.5 W
Configurable TDP-down Frequency		600 MHz
Configurable TDP-up		6 W
Configurable TDP-up Frequency		1.30 GHz
Scenario Design Power (SDP)		3.5 W
Peripherals
Max number of PCIe lanes	16	12
PCI Express revision	3.0	2.0
PCIe configurations	Up to 1x16, 2x8, 1x8+2x4	x1 (6), x2 (4), x4 (3)
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Flexible Display interface (FDI)
Intel® Advanced Vector Extensions (AVX)
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Smart Response technology
Intel® Stable Image Platform Program (SIPP)
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)