Intel Core i3-6102E vs Intel Core M-5Y51
Comparative analysis of Intel Core i3-6102E and Intel Core M-5Y51 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i3-6102E
- Around 5% higher maximum core temperature: 100°C vs 95 °C
- 4x more maximum memory size: 64 GB vs 16 GB
- Around 17% better performance in PassMark - CPU mark: 2349 vs 2016
Specifications (specs) | |
Maximum core temperature | 100°C vs 95 °C |
Maximum memory size | 64 GB vs 16 GB |
Benchmarks | |
PassMark - CPU mark | 2349 vs 2016 |
Reasons to consider the Intel Core M-5Y51
- 5x lower typical power consumption: 4.5 Watt vs 25 Watt
- Around 23% better performance in PassMark - Single thread mark: 1312 vs 1068
Specifications (specs) | |
Thermal Design Power (TDP) | 4.5 Watt vs 25 Watt |
Benchmarks | |
PassMark - Single thread mark | 1312 vs 1068 |
Compare benchmarks
CPU 1: Intel Core i3-6102E
CPU 2: Intel Core M-5Y51
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i3-6102E | Intel Core M-5Y51 |
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PassMark - Single thread mark | 1068 | 1312 |
PassMark - CPU mark | 2349 | 2016 |
Geekbench 4 - Single Core | 462 | |
Geekbench 4 - Multi-Core | 830 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 560 | |
GFXBench 4.0 - Manhattan (Frames) | 1304 | |
GFXBench 4.0 - T-Rex (Frames) | 1954 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 560 | |
GFXBench 4.0 - Manhattan (Fps) | 1304 | |
GFXBench 4.0 - T-Rex (Fps) | 1954 |
Compare specifications (specs)
Intel Core i3-6102E | Intel Core M-5Y51 | |
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Essentials |
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Architecture codename | Skylake | Broadwell |
Launch date | Q4'15 | 1 December 2014 |
Place in performance rating | 2170 | 2161 |
Processor Number | i3-6102E | 5Y51 |
Series | 6th Generation Intel® Core™ i3 Processors | 5th Generation Intel® Core™ M Processors |
Status | Launched | Launched |
Vertical segment | Embedded | Mobile |
Performance |
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64 bit support | ||
Base frequency | 1.90 GHz | 1.10 GHz |
Bus Speed | 8 GT/s DMI3 | |
Manufacturing process technology | 14 nm | 14 nm |
Maximum core temperature | 100°C | 95 °C |
Number of cores | 2 | 2 |
Number of threads | 4 | 4 |
Die size | 82 mm | |
L1 cache | 128 KB | |
L2 cache | 512 KB | |
L3 cache | 4 MB | |
Maximum frequency | 2.60 GHz | |
Transistor count | 1300 Million | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 34.1 GB/s | 25.6 GB/s |
Maximum memory size | 64 GB | 16 GB |
Supported memory types | DDR4-2133, LPDDR3-1866, DDR3L-1600 | LPDDR3 1333/1600; DDR3L/DDR3L-RS 1600 |
Graphics |
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Device ID | 0x191B | 0x161E |
Graphics base frequency | 350 MHz | 300 MHz |
Graphics max dynamic frequency | 950 MHz | 900 MHz |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | 16 GB |
Processor graphics | Intel® HD Graphics 530 | Intel® HD Graphics 5300 |
Graphics max frequency | 900 MHz | |
Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 3 |
Wireless Display (WiDi) support | ||
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | 2560x1600@60Hz |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | 2560x1600@60Hz |
Graphics API support |
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DirectX | 12 | 11.2/12 |
OpenGL | 4.5 | 4.3 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 42mm x 28mm | 30mm x 16.5mm |
Sockets supported | FCBGA1440 | FCBGA1234 |
Thermal Design Power (TDP) | 25 Watt | 4.5 Watt |
Configurable TDP-down | 3.5 W | |
Configurable TDP-down Frequency | 600 MHz | |
Configurable TDP-up | 6 W | |
Configurable TDP-up Frequency | 1.30 GHz | |
Scenario Design Power (SDP) | 3.5 W | |
Peripherals |
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Max number of PCIe lanes | 16 | 12 |
PCI Express revision | 3.0 | 2.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | x1 (6), x2 (4), x4 (3) |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Smart Response technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |