Intel Xeon E3-1230L v3 processor review

Intel Xeon E3-1230L v3

Xeon E3-1230L v3 processor released by Intel; release date: June 2013. At the time of release, the processor cost $289. The processor is designed for server-computers and based on Haswell microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 4, threads - 8. Maximum CPU clock speed - 2.80 GHz. Manufacturing process technology - 22 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 8192 KB (shared).

Supported memory types: DDR3 and DDR3L 1333/1600 at 1.5V. Maximum memory size: 32 GB.

Supported socket types: FCLGA1150. Maximum number of processors in a configuration - 1. Power consumption (TDP): 25 Watt.

The processor has integrated graphics None.

Benchmarks

PassMark
Single thread mark
Top 1 CPU
This CPU
4870
1619
PassMark
CPU mark
Top 1 CPU
This CPU
156834
5258
Name Value
PassMark - Single thread mark 1619
PassMark - CPU mark 5258

Specifications (specs)

Essentials

Architecture codename Haswell
Launch date June 2013
Launch price (MSRP) $289
Place in performance rating 1529
Price now $287.90
Processor Number E3-1230Lv3
Series Intel® Xeon® Processor E3 v3 Family
Status Launched
Value for money (0-100) 7.40
Vertical segment Server

Performance

64 bit support
Base frequency 1.80 GHz
Bus Speed 5 GT/s DMI
Die size 160 mm
L1 cache 64 KB (per core)
L2 cache 256 KB (per core)
L3 cache 8192 KB (shared)
Manufacturing process technology 22 nm
Maximum frequency 2.80 GHz
Number of cores 4
Number of QPI Links 0
Number of threads 8
Transistor count 1400 million

Memory

ECC memory support
Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB
Supported memory types DDR3 and DDR3L 1333/1600 at 1.5V

Graphics

Processor graphics None

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 37.5mm x 37.5mm
Sockets supported FCLGA1150
Thermal Design Power (TDP) 25 Watt
Thermal Solution PCG 2013A

Peripherals

Max number of PCIe lanes 16
PCI Express revision 3.0
PCIe configurations 1x16, 2x8, 1x8/2x4
Scalability 1S Only

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)