AMD Mobile Sempron 3300+ vs AMD Athlon XP-M 2600+

Comparative analysis of AMD Mobile Sempron 3300+ and AMD Athlon XP-M 2600+ processors for all known characteristics in the following categories: Essentials, Performance, Compatibility. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Mobile Sempron 3300+

AMD Athlon XP-M 2600+

Differences

Reasons to consider the AMD Mobile Sempron 3300+

CPU is newer: launch date 4 year(s) 5 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 130 nm
Around 20% better performance in PassMark - CPU mark: 445 vs 370

Specifications (specs)
Launch date	1 June 2005 vs January 2001
Manufacturing process technology	90 nm vs 130 nm
Benchmarks
PassMark - CPU mark	445 vs 370

Reasons to consider the AMD Athlon XP-M 2600+

4x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 38% lower typical power consumption: 45 Watt vs 62 / 25 Watt
Around 1% better performance in PassMark - Single thread mark: 577 vs 574

Specifications (specs)
L2 cache	512 KB vs 128 KB
Thermal Design Power (TDP)	45 Watt vs 62 / 25 Watt
Benchmarks
PassMark - Single thread mark	577 vs 574

Compare benchmarks

CPU 1: AMD Mobile Sempron 3300+
CPU 2: AMD Athlon XP-M 2600+

PassMark - Single thread mark

CPU 1

CPU 2

574

577

PassMark - CPU mark

CPU 1

CPU 2

445

370

Name	AMD Mobile Sempron 3300+	AMD Athlon XP-M 2600+
PassMark - Single thread mark	574	577
PassMark - CPU mark	445	370

Compare specifications (specs)

	AMD Mobile Sempron 3300+	AMD Athlon XP-M 2600+
Essentials
Architecture codename	Roma	Barton
Launch date	1 June 2005	January 2001
Place in performance rating	2884	2885
Series	AMD Mobile Sempron
Vertical segment	Laptop	Laptop
Performance
64 bit support
Front-side bus (FSB)	800 MHz
L2 cache	128 KB	512 KB
Manufacturing process technology	90 nm	130 nm
Maximum frequency	2 GHz	2 GHz
Number of cores	1	1
Number of threads	1
Die size		101 mm
L1 cache		128 KB
Transistor count		63 million
Compatibility
Sockets supported	745	A
Thermal Design Power (TDP)	62 / 25 Watt	45 Watt
Max number of CPUs in a configuration		1