AMD Opteron 2350 HE vs AMD Opteron 144
Comparative analysis of AMD Opteron 2350 HE and AMD Opteron 144 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Opteron 2350 HE
- CPU is newer: launch date 5 year(s) 0 month(s) later
- 3 more cores, run more applications at once: 4 vs 1
- Around 11% higher clock speed: 2 GHz vs 1.8 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 130 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 4% lower typical power consumption: 79 Watt vs 82 Watt
- 8.9x better performance in PassMark - CPU mark: 2820 vs 316
Specifications (specs) | |
Launch date | October 2008 vs September 2003 |
Number of cores | 4 vs 1 |
Maximum frequency | 2 GHz vs 1.8 GHz |
Manufacturing process technology | 65 nm vs 130 nm |
L1 cache | 256 KB (shared) vs 128 KB |
L2 cache | 2048 KB (shared) vs 1024 KB |
Thermal Design Power (TDP) | 79 Watt vs 82 Watt |
Benchmarks | |
PassMark - CPU mark | 2820 vs 316 |
Compare benchmarks
CPU 1: AMD Opteron 2350 HE
CPU 2: AMD Opteron 144
PassMark - CPU mark |
|
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Name | AMD Opteron 2350 HE | AMD Opteron 144 |
---|---|---|
PassMark - Single thread mark | 0 | 376 |
PassMark - CPU mark | 2820 | 316 |
Compare specifications (specs)
AMD Opteron 2350 HE | AMD Opteron 144 | |
---|---|---|
Essentials |
||
Architecture codename | Barcelona | SledgeHammer |
Launch date | October 2008 | September 2003 |
Place in performance rating | 3317 | 3172 |
Vertical segment | Server | Server |
Launch price (MSRP) | $65 | |
Price now | $65 | |
Value for money (0-100) | 2.20 | |
Performance |
||
64 bit support | ||
Die size | 285 mm | 193 mm |
L1 cache | 256 KB (shared) | 128 KB |
L2 cache | 2048 KB (shared) | 1024 KB |
L3 cache | 2048 KB | |
Manufacturing process technology | 65 nm | 130 nm |
Maximum case temperature (TCase) | 76 °C | |
Maximum frequency | 2 GHz | 1.8 GHz |
Number of cores | 4 | 1 |
Transistor count | 463 million | 106 million |
Compatibility |
||
Sockets supported | Fr2 | 940 |
Thermal Design Power (TDP) | 79 Watt | 82 Watt |
Max number of CPUs in a configuration | 1 |