AMD Opteron 2419 EE vs AMD Opteron 2350 HE

Comparative analysis of AMD Opteron 2419 EE and AMD Opteron 2350 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Opteron 2419 EE

AMD Opteron 2350 HE

Differences

Reasons to consider the AMD Opteron 2419 EE

CPU is newer: launch date 11 month(s) later
2 more cores, run more applications at once: 6 vs 4
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
3x more L1 cache, more data can be stored in the L1 cache for quick access later
Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
3x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 32% lower typical power consumption: 60 Watt vs 79 Watt

Launch date	31 Aug 2009 vs October 2008
Number of cores	6 vs 4
Manufacturing process technology	45 nm vs 65 nm
L1 cache	768 KB vs 256 KB (shared)
L2 cache	3 MB vs 2048 KB (shared)
L3 cache	6 MB vs 2048 KB
Thermal Design Power (TDP)	60 Watt vs 79 Watt

Reasons to consider the AMD Opteron 2350 HE

Around 48% better performance in PassMark - CPU mark: 2820 vs 1902

Benchmarks
PassMark - CPU mark	2820 vs 1902

Compare benchmarks

CPU 1: AMD Opteron 2419 EE
CPU 2: AMD Opteron 2350 HE

PassMark - CPU mark

CPU 1

CPU 2

1902

2820

Name	AMD Opteron 2419 EE	AMD Opteron 2350 HE
PassMark - Single thread mark	396	0
PassMark - CPU mark	1902	2820

Compare specifications (specs)

	AMD Opteron 2419 EE	AMD Opteron 2350 HE
Essentials
Architecture codename	K10	Barcelona
Launch date	31 Aug 2009	October 2008
Launch price (MSRP)	$989
Place in performance rating	3094	3328
Vertical segment	Server	Server
Performance
Base frequency	1.8 GHz
L1 cache	768 KB	256 KB (shared)
L2 cache	3 MB	2048 KB (shared)
L3 cache	6 MB	2048 KB
Manufacturing process technology	45 nm	65 nm
Maximum core temperature	68 °C
Number of cores	6	4
Number of threads	6
64 bit support
Die size		285 mm
Maximum case temperature (TCase)		76 °C
Maximum frequency		2 GHz
Transistor count		463 million
Memory
Max memory channels	2
Maximum memory size	256 TB
Supported memory types	DDR2
Compatibility
Max number of CPUs in a configuration	2
Sockets supported	Fr6 (LGA 1207)	Fr2
Thermal Design Power (TDP)	60 Watt	79 Watt