AMD Opteron X2 875 HE vs Intel Core Duo T2600

Comparative analysis of AMD Opteron X2 875 HE and Intel Core Duo T2600 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Opteron X2 875 HE

Intel Core Duo T2600

Differences

Reasons to consider the AMD Opteron X2 875 HE

Around 2% higher clock speed: 2.2 GHz vs 2.16 GHz

Maximum frequency	2.2 GHz vs 2.16 GHz
Max number of CPUs in a configuration	8 vs 1

Reasons to consider the Intel Core Duo T2600

A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 77% lower typical power consumption: 31 Watt vs 55 Watt

Manufacturing process technology	65 nm vs 90 nm
L2 cache	2048 KB vs 1024 KB
Thermal Design Power (TDP)	31 Watt vs 55 Watt

Compare benchmarks

CPU 1: AMD Opteron X2 875 HE
CPU 2: Intel Core Duo T2600

Name	AMD Opteron X2 875 HE	Intel Core Duo T2600
PassMark - Single thread mark		667
PassMark - CPU mark		460

Compare specifications (specs)

	AMD Opteron X2 875 HE	Intel Core Duo T2600
Essentials
Architecture codename	Egypt	Yonah
Launch date	February 2006	5 January 2006
Place in performance rating	not rated	2757
Vertical segment	Server	Mobile
Launch price (MSRP)		$440
Processor Number		T2600
Series		Legacy Intel® Core™ Processors
Status		Discontinued
Performance
64 bit support
L1 cache	128 KB
L2 cache	1024 KB	2048 KB
Manufacturing process technology	90 nm	65 nm
Maximum frequency	2.2 GHz	2.16 GHz
Number of cores	2	2
Transistor count	233 million	151 million
Base frequency		2.16 GHz
Bus Speed		667 MHz FSB
Die size		90 mm2
Front-side bus (FSB)		667 MHz
Maximum core temperature		100°C
Number of threads		2
VID voltage range		1.1625V - 1.30V
Compatibility
Max number of CPUs in a configuration	8	1
Sockets supported	940	PPGA478, PBGA479
Thermal Design Power (TDP)	55 Watt	31 Watt
Low Halogen Options Available
Package Size		35mm x 35mm
Scenario Design Power (SDP)		0 W
Memory
Supported memory types		DDR1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)		32-bit
Virtualization
Intel® Virtualization Technology (VT-x)