AMD Phenom II X4 650T vs Intel Celeron 725C

Comparative analysis of AMD Phenom II X4 650T and Intel Celeron 725C processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Virtualization, Peripherals, Security & Reliability, Advanced Technologies.

 

Differences

Reasons to consider the AMD Phenom II X4 650T

  • 3 more cores, run more applications at once: 4 vs 1
  • Around 108% higher clock speed: 2.7 GHz vs 1.3 GHz
  • 8x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 8x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 2.7x more L3 cache, more data can be stored in the L3 cache for quick access later
Number of cores 4 vs 1
Maximum frequency 2.7 GHz vs 1.3 GHz
L1 cache 128 KB (per core) vs 64 KB (per core)
L2 cache 512 KB (per core) vs 256 KB (per core)
L3 cache 4096 KB (shared) vs 1536 KB (shared)

Reasons to consider the Intel Celeron 725C

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
  • 9.5x lower typical power consumption: 10 Watt vs 95 Watt
Manufacturing process technology 32 nm vs 45 nm
Thermal Design Power (TDP) 10 Watt vs 95 Watt

Compare specifications (specs)

AMD Phenom II X4 650T Intel Celeron 725C

Essentials

Architecture codename Zosma Gladden
Launch date July 2011 July 2011
Place in performance rating not rated not rated
Vertical segment Desktop Embedded
Processor Number 725C
Series Legacy Intel® Celeron® Processor
Status Launched

Performance

64 bit support
Die size 346 mm 131 mm
L1 cache 128 KB (per core) 64 KB (per core)
L2 cache 512 KB (per core) 256 KB (per core)
L3 cache 4096 KB (shared) 1536 KB (shared)
Manufacturing process technology 45 nm 32 nm
Maximum frequency 2.7 GHz 1.3 GHz
Number of cores 4 1
Transistor count 904 million 504 million
Base frequency 1.30 GHz
Maximum core temperature 100°C
Number of threads 2

Memory

Supported memory types DDR3 DDR3 1066/1333
ECC memory support
Max memory channels 1
Maximum memory bandwidth 21.3 GB/s
Maximum memory size 16 GB

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported AM3 FCBGA1284
Thermal Design Power (TDP) 95 Watt 10 Watt
Low Halogen Options Available
Package Size 37.5mm x 37.5mm

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2
PCIe configurations 1x16 or 2x8 or 1x8 2x4

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

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