AMD Phenom II X4 650T vs Intel Celeron 725C
Comparative analysis of AMD Phenom II X4 650T and Intel Celeron 725C processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Virtualization, Peripherals, Security & Reliability, Advanced Technologies.
Differences
Reasons to consider the AMD Phenom II X4 650T
- 3 more cores, run more applications at once: 4 vs 1
- Around 108% higher clock speed: 2.7 GHz vs 1.3 GHz
- 8x more L1 cache, more data can be stored in the L1 cache for quick access later
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2.7x more L3 cache, more data can be stored in the L3 cache for quick access later
Number of cores | 4 vs 1 |
Maximum frequency | 2.7 GHz vs 1.3 GHz |
L1 cache | 128 KB (per core) vs 64 KB (per core) |
L2 cache | 512 KB (per core) vs 256 KB (per core) |
L3 cache | 4096 KB (shared) vs 1536 KB (shared) |
Reasons to consider the Intel Celeron 725C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 9.5x lower typical power consumption: 10 Watt vs 95 Watt
Manufacturing process technology | 32 nm vs 45 nm |
Thermal Design Power (TDP) | 10 Watt vs 95 Watt |
Compare specifications (specs)
AMD Phenom II X4 650T | Intel Celeron 725C | |
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Essentials |
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Architecture codename | Zosma | Gladden |
Launch date | July 2011 | July 2011 |
Place in performance rating | not rated | not rated |
Vertical segment | Desktop | Embedded |
Processor Number | 725C | |
Series | Legacy Intel® Celeron® Processor | |
Status | Launched | |
Performance |
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64 bit support | ||
Die size | 346 mm | 131 mm |
L1 cache | 128 KB (per core) | 64 KB (per core) |
L2 cache | 512 KB (per core) | 256 KB (per core) |
L3 cache | 4096 KB (shared) | 1536 KB (shared) |
Manufacturing process technology | 45 nm | 32 nm |
Maximum frequency | 2.7 GHz | 1.3 GHz |
Number of cores | 4 | 1 |
Transistor count | 904 million | 504 million |
Base frequency | 1.30 GHz | |
Maximum core temperature | 100°C | |
Number of threads | 2 | |
Memory |
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Supported memory types | DDR3 | DDR3 1066/1333 |
ECC memory support | ||
Max memory channels | 1 | |
Maximum memory bandwidth | 21.3 GB/s | |
Maximum memory size | 16 GB | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | AM3 | FCBGA1284 |
Thermal Design Power (TDP) | 95 Watt | 10 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2 | |
PCIe configurations | 1x16 or 2x8 or 1x8 2x4 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring |