AMD Phenom II X4 650T vs Intel Celeron 857

Comparative analysis of AMD Phenom II X4 650T and Intel Celeron 857 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Virtualization, Graphics, Graphics interfaces, Peripherals, Security & Reliability, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Phenom II X4 650T

Intel Celeron 857

Differences

Reasons to consider the AMD Phenom II X4 650T

2 more cores, run more applications at once: 4 vs 2
Around 125% higher clock speed: 2.7 GHz vs 1.2 GHz
4x more L1 cache, more data can be stored in the L1 cache for quick access later
4x more L2 cache, more data can be stored in the L2 cache for quick access later
2x more L3 cache, more data can be stored in the L3 cache for quick access later

Number of cores	4 vs 2
Maximum frequency	2.7 GHz vs 1.2 GHz
L1 cache	128 KB (per core) vs 64 KB (per core)
L2 cache	512 KB (per core) vs 256 KB (per core)
L3 cache	4096 KB (shared) vs 2048 KB (shared)

Reasons to consider the Intel Celeron 857

A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
5.6x lower typical power consumption: 17 Watt vs 95 Watt

Manufacturing process technology	32 nm vs 45 nm
Thermal Design Power (TDP)	17 Watt vs 95 Watt

Compare benchmarks

CPU 1: AMD Phenom II X4 650T
CPU 2: Intel Celeron 857

Name	AMD Phenom II X4 650T	Intel Celeron 857
PassMark - Single thread mark		476
PassMark - CPU mark		569

Compare specifications (specs)

	AMD Phenom II X4 650T	Intel Celeron 857
Essentials
Architecture codename	Zosma	Sandy Bridge
Launch date	July 2011	July 2011
Place in performance rating	not rated	3021
Vertical segment	Desktop	Mobile
Processor Number		857
Series		Legacy Intel® Celeron® Processor
Status		Launched
Performance
64 bit support
Die size	346 mm	131 mm
L1 cache	128 KB (per core)	64 KB (per core)
L2 cache	512 KB (per core)	256 KB (per core)
L3 cache	4096 KB (shared)	2048 KB (shared)
Manufacturing process technology	45 nm	32 nm
Maximum frequency	2.7 GHz	1.2 GHz
Number of cores	4	2
Transistor count	904 million	504 million
Base frequency		1.20 GHz
Bus Speed		5 GT/s DMI
Maximum core temperature		100 °C
Number of threads		2
Memory
Supported memory types	DDR3	DDR3 1066/1333
Max memory channels		2
Maximum memory bandwidth		21.3 GB/s
Maximum memory size		16 GB
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	AM3	Intel BGA1023
Thermal Design Power (TDP)	95 Watt	17 Watt
Low Halogen Options Available
Package Size		31.0mm x 24.0mm (BGA1023)
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Graphics
Graphics base frequency		350 MHz
Graphics max dynamic frequency		1.00 GHz
Graphics max frequency		1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel HD Graphics
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported		2
SDVO
Wireless Display (WiDi) support
Peripherals
Max number of PCIe lanes		16
PCI Express revision		2.0
PCIe configurations		1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring