AMD Ryzen 3 3200G vs Intel Celeron G555

Comparative analysis of AMD Ryzen 3 3200G and Intel Celeron G555 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

 

Differences

Reasons to consider the AMD Ryzen 3 3200G

  • CPU is newer: launch date 6 year(s) 10 month(s) later
  • Processor is unlocked, an unlocked multiplier allows for easier overclocking
  • 2 more cores, run more applications at once: 4 vs 2
  • 2 more threads: 4 vs 2
  • Around 48% higher clock speed: 4 GHz vs 2.7 GHz
  • Around 37% higher maximum core temperature: 95 °C vs 69.1°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 32 nm
  • 3x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 2x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 6% better performance in Geekbench 4 - Multi-Core: 2901 vs 2746
  • Around 71% better performance in PassMark - Single thread mark: 2206 vs 1289
  • 5.1x better performance in PassMark - CPU mark: 7129 vs 1388
Specifications (specs)
Launch date 7 July 2019 vs September 2012
Unlocked Unlocked vs Locked
Number of cores 4 vs 2
Number of threads 4 vs 2
Maximum frequency 4 GHz vs 2.7 GHz
Maximum core temperature 95 °C vs 69.1°C
Manufacturing process technology 12 nm vs 32 nm
L1 cache 384 KB vs 64 KB (per core)
L2 cache 2 MB vs 256 KB (per core)
L3 cache 4 MB vs 2048 KB (shared)
Benchmarks
Geekbench 4 - Multi-Core 2901 vs 2746
PassMark - Single thread mark 2206 vs 1289
PassMark - CPU mark 7129 vs 1388

Reasons to consider the Intel Celeron G555

  • Around 94% better performance in Geekbench 4 - Single Core: 1717 vs 886
Benchmarks
Geekbench 4 - Single Core 1717 vs 886

Compare benchmarks

CPU 1: AMD Ryzen 3 3200G
CPU 2: Intel Celeron G555

Geekbench 4 - Single Core
CPU 1
CPU 2
886
1717
Geekbench 4 - Multi-Core
CPU 1
CPU 2
2901
2746
PassMark - Single thread mark
CPU 1
CPU 2
2206
1289
PassMark - CPU mark
CPU 1
CPU 2
7129
1388
Name AMD Ryzen 3 3200G Intel Celeron G555
Geekbench 4 - Single Core 886 1717
Geekbench 4 - Multi-Core 2901 2746
PassMark - Single thread mark 2206 1289
PassMark - CPU mark 7129 1388
3DMark Fire Strike - Physics Score 1933

Compare specifications (specs)

AMD Ryzen 3 3200G Intel Celeron G555

Essentials

Family Ryzen
Launch date 7 July 2019 September 2012
OPN PIB YD3200C5FHBOX
OPN Tray YD3200C5M4MFH
Place in performance rating 1684 1653
Series Ryzen 3 Legacy Intel® Celeron® Processor
Vertical segment Desktop Desktop
Architecture codename Sandy Bridge
Launch price (MSRP) $89
Price now $153.59
Processor Number G555
Status Discontinued
Value for money (0-100) 4.65

Performance

64 bit support
Base frequency 3.6 GHz 2.70 GHz
L1 cache 384 KB 64 KB (per core)
L2 cache 2 MB 256 KB (per core)
L3 cache 4 MB 2048 KB (shared)
Manufacturing process technology 12 nm 32 nm
Maximum core temperature 95 °C 69.1°C
Maximum frequency 4 GHz 2.7 GHz
Number of cores 4 2
Number of GPU cores 8
Number of threads 4 2
Unlocked
Bus Speed 5 GT/s DMI
Die size 131 mm
Transistor count 504 million

Memory

Max memory channels 2 2
Supported memory frequency 2933 MHz
Supported memory types DDR4-2933 DDR3 1066
Maximum memory bandwidth 17 GB/s
Maximum memory size 32 GB

Graphics

Graphics base frequency 1250 MHz 850 MHz
iGPU core count 8
Processor graphics Radeon Vega 8 Graphics Intel HD Graphics
Graphics max dynamic frequency 1.00 GHz
Graphics max frequency 1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video

Graphics interfaces

DisplayPort
HDMI
Number of displays supported 2
Wireless Display (WiDi) support

Compatibility

Configurable TDP 45-65 Watt
Sockets supported AM4 FCLGA1155
Thermal Design Power (TDP) 65 Watt 65 Watt
Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 37.5mm x 37.5mm

Peripherals

PCI Express revision 3.0 2.0
PCIe configurations x8

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)