AMD Ryzen 3 3200G vs Intel Celeron G555

Comparative analysis of AMD Ryzen 3 3200G and Intel Celeron G555 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

AMD Ryzen 3 3200G

Intel Celeron G555

Differences

Reasons to consider the AMD Ryzen 3 3200G

CPU is newer: launch date 6 year(s) 10 month(s) later
Processor is unlocked, an unlocked multiplier allows for easier overclocking
2 more cores, run more applications at once: 4 vs 2
2 more threads: 4 vs 2
Around 48% higher clock speed: 4 GHz vs 2.7 GHz
Around 37% higher maximum core temperature: 95 °C vs 69.1°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 32 nm
3x more L1 cache, more data can be stored in the L1 cache for quick access later
4x more L2 cache, more data can be stored in the L2 cache for quick access later
2x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 6% better performance in Geekbench 4 - Multi-Core: 2901 vs 2746
Around 71% better performance in PassMark - Single thread mark: 2207 vs 1289
5.1x better performance in PassMark - CPU mark: 7135 vs 1388

Specifications (specs)
Launch date	7 July 2019 vs September 2012
Unlocked	Unlocked vs Locked
Number of cores	4 vs 2
Number of threads	4 vs 2
Maximum frequency	4 GHz vs 2.7 GHz
Maximum core temperature	95 °C vs 69.1°C
Manufacturing process technology	12 nm vs 32 nm
L1 cache	384 KB vs 64 KB (per core)
L2 cache	2 MB vs 256 KB (per core)
L3 cache	4 MB vs 2048 KB (shared)
Benchmarks
Geekbench 4 - Multi-Core	2901 vs 2746
PassMark - Single thread mark	2207 vs 1289
PassMark - CPU mark	7135 vs 1388

Reasons to consider the Intel Celeron G555

Around 94% better performance in Geekbench 4 - Single Core: 1717 vs 886

Benchmarks
Geekbench 4 - Single Core	1717 vs 886

Compare benchmarks

CPU 1: AMD Ryzen 3 3200G
CPU 2: Intel Celeron G555

Geekbench 4 - Single Core

CPU 1

CPU 2

886

1717

Geekbench 4 - Multi-Core

CPU 1

CPU 2

2901

2746

PassMark - Single thread mark

CPU 1

CPU 2

2207

1289

PassMark - CPU mark

CPU 1

CPU 2

7135

1388

Name	AMD Ryzen 3 3200G	Intel Celeron G555
Geekbench 4 - Single Core	886	1717
Geekbench 4 - Multi-Core	2901	2746
PassMark - Single thread mark	2207	1289
PassMark - CPU mark	7135	1388
3DMark Fire Strike - Physics Score	3185

Compare specifications (specs)

	AMD Ryzen 3 3200G	Intel Celeron G555
Essentials
Family	Ryzen
Launch date	7 July 2019	September 2012
OPN PIB	YD3200C5FHBOX
OPN Tray	YD3200C5M4MFH
Place in performance rating	1575	1582
Series	Ryzen 3	Legacy Intel® Celeron® Processor
Vertical segment	Desktop	Desktop
Architecture codename		Sandy Bridge
Launch price (MSRP)		$89
Price now		$153.59
Processor Number		G555
Status		Discontinued
Value for money (0-100)		4.65
Performance
64 bit support
Base frequency	3.6 GHz	2.70 GHz
L1 cache	384 KB	64 KB (per core)
L2 cache	2 MB	256 KB (per core)
L3 cache	4 MB	2048 KB (shared)
Manufacturing process technology	12 nm	32 nm
Maximum core temperature	95 °C	69.1°C
Maximum frequency	4 GHz	2.7 GHz
Number of cores	4	2
Number of GPU cores	8
Number of threads	4	2
Unlocked
Bus Speed		5 GT/s DMI
Die size		131 mm
Transistor count		504 million
Memory
Max memory channels	2	2
Supported memory frequency	2933 MHz
Supported memory types	DDR4-2933	DDR3 1066
Maximum memory bandwidth		17 GB/s
Maximum memory size		32 GB
Graphics
Graphics base frequency	1250 MHz	850 MHz
iGPU core count	8
Processor graphics	Radeon Vega 8 Graphics	Intel HD Graphics
Graphics max dynamic frequency		1.00 GHz
Graphics max frequency		1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Graphics interfaces
DisplayPort
HDMI
Number of displays supported		2
Wireless Display (WiDi) support
Compatibility
Configurable TDP	45-65 Watt
Sockets supported	AM4	FCLGA1155
Thermal Design Power (TDP)	65 Watt	65 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Package Size		37.5mm x 37.5mm
Peripherals
PCI Express revision	3.0	2.0
PCIe configurations	x8
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)