AMD Ryzen 3 3200G vs Intel Celeron G555
Comparative analysis of AMD Ryzen 3 3200G and Intel Celeron G555 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Ryzen 3 3200G
- CPU is newer: launch date 6 year(s) 10 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 2 more cores, run more applications at once: 4 vs 2
- 2 more threads: 4 vs 2
- Around 48% higher clock speed: 4 GHz vs 2.7 GHz
- Around 37% higher maximum core temperature: 95 °C vs 69.1°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 32 nm
- 3x more L1 cache, more data can be stored in the L1 cache for quick access later
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 6% better performance in Geekbench 4 - Multi-Core: 2901 vs 2746
- Around 71% better performance in PassMark - Single thread mark: 2206 vs 1289
- 5.1x better performance in PassMark - CPU mark: 7129 vs 1388
Specifications (specs) | |
Launch date | 7 July 2019 vs September 2012 |
Unlocked | Unlocked vs Locked |
Number of cores | 4 vs 2 |
Number of threads | 4 vs 2 |
Maximum frequency | 4 GHz vs 2.7 GHz |
Maximum core temperature | 95 °C vs 69.1°C |
Manufacturing process technology | 12 nm vs 32 nm |
L1 cache | 384 KB vs 64 KB (per core) |
L2 cache | 2 MB vs 256 KB (per core) |
L3 cache | 4 MB vs 2048 KB (shared) |
Benchmarks | |
Geekbench 4 - Multi-Core | 2901 vs 2746 |
PassMark - Single thread mark | 2206 vs 1289 |
PassMark - CPU mark | 7129 vs 1388 |
Reasons to consider the Intel Celeron G555
- Around 94% better performance in Geekbench 4 - Single Core: 1717 vs 886
Benchmarks | |
Geekbench 4 - Single Core | 1717 vs 886 |
Compare benchmarks
CPU 1: AMD Ryzen 3 3200G
CPU 2: Intel Celeron G555
Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 3 3200G | Intel Celeron G555 |
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Geekbench 4 - Single Core | 886 | 1717 |
Geekbench 4 - Multi-Core | 2901 | 2746 |
PassMark - Single thread mark | 2206 | 1289 |
PassMark - CPU mark | 7129 | 1388 |
3DMark Fire Strike - Physics Score | 1933 |
Compare specifications (specs)
AMD Ryzen 3 3200G | Intel Celeron G555 | |
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Essentials |
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Family | Ryzen | |
Launch date | 7 July 2019 | September 2012 |
OPN PIB | YD3200C5FHBOX | |
OPN Tray | YD3200C5M4MFH | |
Place in performance rating | 1685 | 1654 |
Series | Ryzen 3 | Legacy Intel® Celeron® Processor |
Vertical segment | Desktop | Desktop |
Architecture codename | Sandy Bridge | |
Launch price (MSRP) | $89 | |
Price now | $153.59 | |
Processor Number | G555 | |
Status | Discontinued | |
Value for money (0-100) | 4.65 | |
Performance |
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64 bit support | ||
Base frequency | 3.6 GHz | 2.70 GHz |
L1 cache | 384 KB | 64 KB (per core) |
L2 cache | 2 MB | 256 KB (per core) |
L3 cache | 4 MB | 2048 KB (shared) |
Manufacturing process technology | 12 nm | 32 nm |
Maximum core temperature | 95 °C | 69.1°C |
Maximum frequency | 4 GHz | 2.7 GHz |
Number of cores | 4 | 2 |
Number of GPU cores | 8 | |
Number of threads | 4 | 2 |
Unlocked | ||
Bus Speed | 5 GT/s DMI | |
Die size | 131 mm | |
Transistor count | 504 million | |
Memory |
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Max memory channels | 2 | 2 |
Supported memory frequency | 2933 MHz | |
Supported memory types | DDR4-2933 | DDR3 1066 |
Maximum memory bandwidth | 17 GB/s | |
Maximum memory size | 32 GB | |
Graphics |
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Graphics base frequency | 1250 MHz | 850 MHz |
iGPU core count | 8 | |
Processor graphics | Radeon Vega 8 Graphics | Intel HD Graphics |
Graphics max dynamic frequency | 1.00 GHz | |
Graphics max frequency | 1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Graphics interfaces |
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DisplayPort | ||
HDMI | ||
Number of displays supported | 2 | |
Wireless Display (WiDi) support | ||
Compatibility |
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Configurable TDP | 45-65 Watt | |
Sockets supported | AM4 | FCLGA1155 |
Thermal Design Power (TDP) | 65 Watt | 65 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Peripherals |
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PCI Express revision | 3.0 | 2.0 |
PCIe configurations | x8 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |