AMD Ryzen 3 3200G vs Intel Core i5-4670
Comparative analysis of AMD Ryzen 3 3200G and Intel Core i5-4670 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Graphics image quality, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the AMD Ryzen 3 3200G
- CPU is newer: launch date 6 year(s) 1 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- Around 5% higher clock speed: 4 GHz vs 3.80 GHz
- Around 31% higher maximum core temperature: 95 °C vs 72.72°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 22 nm
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 29% lower typical power consumption: 65 Watt vs 84 Watt
- Around 1% better performance in Geekbench 4 - Single Core: 886 vs 881
- Around 3% better performance in Geekbench 4 - Multi-Core: 2901 vs 2829
- Around 3% better performance in PassMark - Single thread mark: 2206 vs 2137
- Around 30% better performance in PassMark - CPU mark: 7129 vs 5497
| Specifications (specs) | |
| Launch date | 7 July 2019 vs June 2013 |
| Unlocked | Unlocked vs Locked |
| Maximum frequency | 4 GHz vs 3.80 GHz |
| Maximum core temperature | 95 °C vs 72.72°C |
| Manufacturing process technology | 12 nm vs 22 nm |
| L1 cache | 384 KB vs 64 KB (per core) |
| L2 cache | 2 MB vs 256 KB (per core) |
| Thermal Design Power (TDP) | 65 Watt vs 84 Watt |
| Benchmarks | |
| Geekbench 4 - Single Core | 886 vs 881 |
| Geekbench 4 - Multi-Core | 2901 vs 2829 |
| PassMark - Single thread mark | 2206 vs 2137 |
| PassMark - CPU mark | 7129 vs 5497 |
Reasons to consider the Intel Core i5-4670
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 55% better performance in 3DMark Fire Strike - Physics Score: 2991 vs 1933
| Specifications (specs) | |
| L3 cache | 6144 KB (shared) vs 4 MB |
| Benchmarks | |
| 3DMark Fire Strike - Physics Score | 2991 vs 1933 |
Compare benchmarks
CPU 1: AMD Ryzen 3 3200G
CPU 2: Intel Core i5-4670
| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| 3DMark Fire Strike - Physics Score |
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| Name | AMD Ryzen 3 3200G | Intel Core i5-4670 |
|---|---|---|
| Geekbench 4 - Single Core | 886 | 881 |
| Geekbench 4 - Multi-Core | 2901 | 2829 |
| PassMark - Single thread mark | 2206 | 2137 |
| PassMark - CPU mark | 7129 | 5497 |
| 3DMark Fire Strike - Physics Score | 1933 | 2991 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 3.854 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 76.671 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.415 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.164 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 6.241 | |
| GFXBench 4.0 - Car Chase Offscreen (Frames) | 1136 | |
| GFXBench 4.0 - Manhattan (Frames) | 2584 | |
| GFXBench 4.0 - T-Rex (Frames) | 3347 | |
| GFXBench 4.0 - Car Chase Offscreen (Fps) | 1136 | |
| GFXBench 4.0 - Manhattan (Fps) | 2584 | |
| GFXBench 4.0 - T-Rex (Fps) | 3347 |
Compare specifications (specs)
| AMD Ryzen 3 3200G | Intel Core i5-4670 | |
|---|---|---|
Essentials |
||
| Family | Ryzen | |
| Launch date | 7 July 2019 | June 2013 |
| OPN PIB | YD3200C5FHBOX | |
| OPN Tray | YD3200C5M4MFH | |
| Place in performance rating | 1685 | 1680 |
| Series | Ryzen 3 | 4th Generation Intel® Core™ i5 Processors |
| Vertical segment | Desktop | Desktop |
| Architecture codename | Haswell | |
| Launch price (MSRP) | $360 | |
| Price now | $187.99 | |
| Processor Number | i5-4670 | |
| Status | Discontinued | |
| Value for money (0-100) | 11.65 | |
Performance |
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| 64 bit support | ||
| Base frequency | 3.6 GHz | 3.40 GHz |
| L1 cache | 384 KB | 64 KB (per core) |
| L2 cache | 2 MB | 256 KB (per core) |
| L3 cache | 4 MB | 6144 KB (shared) |
| Manufacturing process technology | 12 nm | 22 nm |
| Maximum core temperature | 95 °C | 72.72°C |
| Maximum frequency | 4 GHz | 3.80 GHz |
| Number of cores | 4 | 4 |
| Number of GPU cores | 8 | |
| Number of threads | 4 | 4 |
| Unlocked | ||
| Bus Speed | 5 GT/s DMI2 | |
| Die size | 177 mm | |
| Maximum case temperature (TCase) | 72 °C | |
| Transistor count | 1400 million | |
Memory |
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| Max memory channels | 2 | 2 |
| Supported memory frequency | 2933 MHz | |
| Supported memory types | DDR4-2933 | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V |
| Maximum memory bandwidth | 25.6 GB/s | |
| Maximum memory size | 32 GB | |
Graphics |
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| Graphics base frequency | 1250 MHz | 350 MHz |
| iGPU core count | 8 | |
| Processor graphics | Radeon Vega 8 Graphics | Intel® HD Graphics 4600 |
| Device ID | 0x412 | |
| Graphics max dynamic frequency | 1.20 GHz | |
| Graphics max frequency | 1.2 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 2 GB | |
Graphics interfaces |
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| DisplayPort | ||
| HDMI | ||
| eDP | ||
| Number of displays supported | 3 | |
| VGA | ||
| Wireless Display (WiDi) support | ||
Compatibility |
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| Configurable TDP | 45-65 Watt | |
| Sockets supported | AM4 | FCLGA1150 |
| Thermal Design Power (TDP) | 65 Watt | 84 Watt |
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 37.5mm x 37.5mm | |
| Thermal Solution | PCG 2013D | |
Peripherals |
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| PCI Express revision | 3.0 | Up to 3.0 |
| PCIe configurations | x8 | Up to 1x16, 2x8, 1x8+2x4 |
| Max number of PCIe lanes | 16 | |
| Scalability | 1S Only | |
Graphics image quality |
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| Max resolution over DisplayPort | 3840x2160@60Hz | |
| Max resolution over eDP | 3840x2160@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
| Max resolution over VGA | 1920x1200@60Hz | |
Graphics API support |
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| DirectX | 11.2/12 | |
| OpenGL | 4.3 | |
Security & Reliability |
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| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Navigation
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