AMD Ryzen 7 6800U vs Intel Pentium G3320TE
Comparative analysis of AMD Ryzen 7 6800U and Intel Pentium G3320TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: 3DMark Fire Strike - Physics Score, PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen 7 6800U
- 6 more cores, run more applications at once: 8 vs 2
- 14 more threads: 16 vs 2
- Around 32% higher maximum core temperature: 95 °C vs 72°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 22 nm
Number of cores | 8 vs 2 |
Number of threads | 16 vs 2 |
Maximum core temperature | 95 °C vs 72°C |
Manufacturing process technology | 7 nm vs 22 nm |
Compare benchmarks
CPU 1: AMD Ryzen 7 6800U
CPU 2: Intel Pentium G3320TE
Name | AMD Ryzen 7 6800U | Intel Pentium G3320TE |
---|---|---|
3DMark Fire Strike - Physics Score | 5170 | |
PassMark - Single thread mark | 1312 | |
PassMark - CPU mark | 1570 |
Compare specifications (specs)
AMD Ryzen 7 6800U | Intel Pentium G3320TE | |
---|---|---|
Essentials |
||
Architecture codename | Zen 3+ | Haswell |
Launch date | Jan 2022 | Q3'13 |
Place in performance rating | 1831 | 1833 |
Vertical segment | Laptop | Embedded |
Processor Number | G3320TE | |
Series | Intel® Pentium® Processor G Series | |
Status | Launched | |
Performance |
||
64 bit support | ||
Base frequency | 3.2 GHz | 2.30 GHz |
Die size | 208 mm² | |
L1 cache | 512 KB | |
L2 cache | 4 MB | |
L3 cache | 16 MB | |
Manufacturing process technology | 7 nm | 22 nm |
Maximum core temperature | 95 °C | 72°C |
Maximum frequency | 4.7 GHz | |
Number of cores | 8 | 2 |
Number of GPU cores | 8 | |
Number of threads | 16 | 2 |
Unlocked | ||
Bus Speed | 5 GT/s DMI2 | |
Number of QPI Links | 1 | |
Memory |
||
ECC memory support | ||
Max memory channels | 2 | 2 |
Supported memory types | DDR5-4800 | DDR3-1333, DDR3L-1333 @ 1.5V |
Maximum memory bandwidth | 21.3 GB/s | |
Maximum memory size | 32 GB | |
Graphics |
||
Graphics base frequency | 2200 MHz | 350 MHz |
Graphics max dynamic frequency | 1.00 GHz | |
Intel® Clear Video HD technology | ||
Intel® Quick Sync Video | ||
Max video memory | 1 GB | |
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
||
DisplayPort | ||
HDMI | ||
DVI | ||
eDP | ||
Number of displays supported | 3 | |
VGA | ||
Compatibility |
||
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FP7 | FCLGA1150 |
Thermal Design Power (TDP) | 35 Watt | 35 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Thermal Solution | PCG 2013A | |
Peripherals |
||
Max number of PCIe lanes | 20 | 16 |
Number of USB ports | 4.0 | |
PCI Express revision | 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8/2x4 | |
Advanced Technologies |
||
Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
||
AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) |