AMD Sempron 180 vs Intel Core 2 Duo E6300
Comparative analysis of AMD Sempron 180 and Intel Core 2 Duo E6300 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Sempron 180
- CPU is newer: launch date 4 year(s) 2 month(s) later
- Around 28% higher clock speed: 2.4 GHz vs 1.87 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 4x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 44% lower typical power consumption: 45 Watt vs 65 Watt
| Launch date | September 2010 vs July 2006 |
| Maximum frequency | 2.4 GHz vs 1.87 GHz |
| Manufacturing process technology | 45 nm vs 65 nm |
| L1 cache | 128 KB (per core) vs 64 KB |
| Thermal Design Power (TDP) | 45 Watt vs 65 Watt |
Reasons to consider the Intel Core 2 Duo E6300
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
| L2 cache | 2048 KB vs 512 KB (per core) |
Compare benchmarks
CPU 1: AMD Sempron 180
CPU 2: Intel Core 2 Duo E6300
| Name | AMD Sempron 180 | Intel Core 2 Duo E6300 |
|---|---|---|
| PassMark - Single thread mark | 695 | |
| PassMark - CPU mark | 652 | |
| Geekbench 4 - Single Core | 251 | |
| Geekbench 4 - Multi-Core | 446 |
Compare specifications (specs)
| AMD Sempron 180 | Intel Core 2 Duo E6300 | |
|---|---|---|
Essentials |
||
| Architecture codename | Regor | Conroe |
| Launch date | September 2010 | July 2006 |
| Place in performance rating | not rated | 3022 |
| Vertical segment | Desktop | Desktop |
| Price now | $12.99 | |
| Processor Number | E6300 | |
| Series | Legacy Intel® Core™ Processors | |
| Status | Discontinued | |
| Value for money (0-100) | 25.13 | |
Performance |
||
| 64 bit support | ||
| Die size | 117 mm | 111 mm2 |
| L1 cache | 128 KB (per core) | 64 KB |
| L2 cache | 512 KB (per core) | 2048 KB |
| Manufacturing process technology | 45 nm | 65 nm |
| Maximum frequency | 2.4 GHz | 1.87 GHz |
| Number of cores | 2 | 2 |
| Transistor count | 234 million | 167 million |
| Base frequency | 1.86 GHz | |
| Bus Speed | 1066 MHz FSB | |
| Maximum core temperature | 61.4°C | |
| VID voltage range | 0.8500V-1.5V | |
Memory |
||
| Supported memory types | DDR3 | DDR1, DDR2, DDR3 |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Sockets supported | AM3 | PLGA775, LGA775 |
| Thermal Design Power (TDP) | 45 Watt | 65 Watt |
| Low Halogen Options Available | ||
| Package Size | 37.5mm x 37.5mm | |
| Scenario Design Power (SDP) | 0 W | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||