AMD Sempron 180 vs Intel Core 2 Duo E6300

Comparative analysis of AMD Sempron 180 and Intel Core 2 Duo E6300 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD Sempron 180

  • CPU is newer: launch date 4 year(s) 2 month(s) later
  • Around 28% higher clock speed: 2.4 GHz vs 1.87 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
  • 4x more L1 cache, more data can be stored in the L1 cache for quick access later
  • Around 44% lower typical power consumption: 45 Watt vs 65 Watt
Launch date September 2010 vs July 2006
Maximum frequency 2.4 GHz vs 1.87 GHz
Manufacturing process technology 45 nm vs 65 nm
L1 cache 128 KB (per core) vs 64 KB
Thermal Design Power (TDP) 45 Watt vs 65 Watt

Reasons to consider the Intel Core 2 Duo E6300

  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
L2 cache 2048 KB vs 512 KB (per core)

Compare benchmarks

CPU 1: AMD Sempron 180
CPU 2: Intel Core 2 Duo E6300

Name AMD Sempron 180 Intel Core 2 Duo E6300
PassMark - Single thread mark 695
PassMark - CPU mark 652
Geekbench 4 - Single Core 251
Geekbench 4 - Multi-Core 446

Compare specifications (specs)

AMD Sempron 180 Intel Core 2 Duo E6300

Essentials

Architecture codename Regor Conroe
Launch date September 2010 July 2006
Place in performance rating not rated 3022
Vertical segment Desktop Desktop
Price now $12.99
Processor Number E6300
Series Legacy Intel® Core™ Processors
Status Discontinued
Value for money (0-100) 25.13

Performance

64 bit support
Die size 117 mm 111 mm2
L1 cache 128 KB (per core) 64 KB
L2 cache 512 KB (per core) 2048 KB
Manufacturing process technology 45 nm 65 nm
Maximum frequency 2.4 GHz 1.87 GHz
Number of cores 2 2
Transistor count 234 million 167 million
Base frequency 1.86 GHz
Bus Speed 1066 MHz FSB
Maximum core temperature 61.4°C
VID voltage range 0.8500V-1.5V

Memory

Supported memory types DDR3 DDR1, DDR2, DDR3

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported AM3 PLGA775, LGA775
Thermal Design Power (TDP) 45 Watt 65 Watt
Low Halogen Options Available
Package Size 37.5mm x 37.5mm
Scenario Design Power (SDP) 0 W

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)