AMD Sempron 2650 vs Intel Core i3-2100
Comparative analysis of AMD Sempron 2650 and Intel Core i3-2100 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Advanced Technologies, Virtualization, Peripherals, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Sempron 2650
- Around 30% higher maximum core temperature: 90°C vs 69.1°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 28 nm vs 32 nm
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2.6x lower typical power consumption: 25 Watt vs 65 Watt
- Around 82% better performance in CompuBench 1.5 Desktop - Face Detection (mPixels/s): 3.724 vs 2.043
- 2.4x better performance in CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s): 84.309 vs 34.598
- Around 37% better performance in CompuBench 1.5 Desktop - T-Rex (Frames/s): 0.31 vs 0.227
- 5.6x better performance in CompuBench 1.5 Desktop - Video Composition (Frames/s): 5.299 vs 0.938
- 6.2x better performance in CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s): 13.811 vs 2.215
| Specifications (specs) | |
| Maximum core temperature | 90°C vs 69.1°C |
| Manufacturing process technology | 28 nm vs 32 nm |
| L2 cache | 1 MB vs 256 KB (per core) |
| Thermal Design Power (TDP) | 25 Watt vs 65 Watt |
| Benchmarks | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 3.724 vs 2.043 |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 84.309 vs 34.598 |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.31 vs 0.227 |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 5.299 vs 0.938 |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 13.811 vs 2.215 |
Reasons to consider the Intel Core i3-2100
- 2 more threads: 4 vs 2
- 3x better performance in PassMark - Single thread mark: 1418 vs 477
- 3.2x better performance in PassMark - CPU mark: 1847 vs 574
- 3.6x better performance in Geekbench 4 - Single Core: 544 vs 151
- 4.8x better performance in Geekbench 4 - Multi-Core: 1208 vs 253
| Specifications (specs) | |
| Number of threads | 4 vs 2 |
| Benchmarks | |
| PassMark - Single thread mark | 1418 vs 477 |
| PassMark - CPU mark | 1847 vs 574 |
| Geekbench 4 - Single Core | 544 vs 151 |
| Geekbench 4 - Multi-Core | 1208 vs 253 |
Compare benchmarks
CPU 1: AMD Sempron 2650
CPU 2: Intel Core i3-2100
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| CompuBench 1.5 Desktop - Face Detection (mPixels/s) |
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| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) |
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| CompuBench 1.5 Desktop - T-Rex (Frames/s) |
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| CompuBench 1.5 Desktop - Video Composition (Frames/s) |
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| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) |
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| Name | AMD Sempron 2650 | Intel Core i3-2100 |
|---|---|---|
| PassMark - Single thread mark | 477 | 1418 |
| PassMark - CPU mark | 574 | 1847 |
| Geekbench 4 - Single Core | 151 | 544 |
| Geekbench 4 - Multi-Core | 253 | 1208 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 3.724 | 2.043 |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 84.309 | 34.598 |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.31 | 0.227 |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 5.299 | 0.938 |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 13.811 | 2.215 |
| 3DMark Fire Strike - Physics Score | 0 |
Compare specifications (specs)
| AMD Sempron 2650 | Intel Core i3-2100 | |
|---|---|---|
Essentials |
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| Family | AMD Sempron | |
| OPN PIB | SD2650JAHMBOX | |
| OPN Tray | SD2650JAH23HM | |
| Place in performance rating | 2820 | 2823 |
| Series | AMD Sempron Dual-Core APU | Legacy Intel® Core™ Processors |
| Vertical segment | Desktop | Desktop |
| Architecture codename | Sandy Bridge | |
| Launch date | February 2011 | |
| Launch price (MSRP) | $73 | |
| Price now | $59.99 | |
| Processor Number | i3-2100 | |
| Status | Discontinued | |
| Value for money (0-100) | 18.10 | |
Performance |
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| Base frequency | 1.45 GHz | 3.10 GHz |
| L1 cache | 128 KB | 64 KB (per core) |
| L2 cache | 1 MB | 256 KB (per core) |
| Manufacturing process technology | 28 nm | 32 nm |
| Maximum core temperature | 90°C | 69.1°C |
| Number of cores | 2 | 2 |
| Number of threads | 2 | 4 |
| Unlocked | ||
| 64 bit support | ||
| Bus Speed | 5 GT/s DMI | |
| Die size | 131 mm | |
| L3 cache | 3072 KB (shared) | |
| Maximum frequency | 3.1 GHz | |
| Transistor count | 504 million | |
Memory |
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| Max memory channels | 1 | 2 |
| Supported memory frequency | 1333 MHz | |
| Maximum memory bandwidth | 21 GB/s | |
| Maximum memory size | 32 GB | |
| Supported memory types | DDR3 1066/1333 | |
Graphics |
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| Enduro | ||
| Graphics max frequency | 400 MHz | 1.1 GHz |
| iGPU core count | 128 | |
| Processor graphics | AMD Radeon R3 Graphics | Intel® HD Graphics 2000 |
| Switchable graphics | ||
| Unified Video Decoder (UVD) | ||
| Video Codec Engine (VCE) | ||
| Device ID | 0x102 | |
| Graphics base frequency | 850 MHz | |
| Graphics max dynamic frequency | 1.10 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
Graphics interfaces |
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| DisplayPort | ||
| HDMI | ||
| Number of displays supported | 2 | |
| Wireless Display (WiDi) support | ||
Graphics API support |
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| DirectX | 12 | |
| Vulkan | ||
Compatibility |
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| Sockets supported | AM1 | FCLGA1155 |
| Thermal Design Power (TDP) | 25 Watt | 65 Watt |
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 37.5mm x 37.5mm | |
Advanced Technologies |
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| AMD App Acceleration | ||
| AMD Elite Experiences | ||
| AMD HD3D technology | ||
| Enhanced Virus Protection (EVP) | ||
| Fused Multiply-Add 4 (FMA4) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| PowerGating | ||
| PowerNow | ||
| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
| Intel 64 | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
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| AMD Virtualization (AMD-V™) | ||
| IOMMU 2.0 | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Trusted Execution technology (TXT) | ||
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