AMD Turion II Neo K645 vs Intel Core i3-390M

Comparative analysis of AMD Turion II Neo K645 and Intel Core i3-390M processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Graphics, Graphics interfaces, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD Turion II Neo K645

Intel Core i3-390M

Differences

Reasons to consider the AMD Turion II Neo K645

2x more L2 cache, more data can be stored in the L2 cache for quick access later
2.3x lower typical power consumption: 15 Watt vs 35 Watt

L2 cache	1 MB vs 512 KB
Thermal Design Power (TDP)	15 Watt vs 35 Watt

Reasons to consider the Intel Core i3-390M

2 more threads: 4 vs 2
Around 66% higher clock speed: 2.66 GHz vs 1.6 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm

Number of threads	4 vs 2
Maximum frequency	2.66 GHz vs 1.6 GHz
Manufacturing process technology	32 nm vs 45 nm

Compare benchmarks

CPU 1: AMD Turion II Neo K645
CPU 2: Intel Core i3-390M

Name	AMD Turion II Neo K645	Intel Core i3-390M
PassMark - Single thread mark		1076
PassMark - CPU mark		1276
Geekbench 4 - Single Core		386
Geekbench 4 - Multi-Core		798

Compare specifications (specs)

	AMD Turion II Neo K645	Intel Core i3-390M
Essentials
Architecture codename	Geneva	Arrandale
Launch date	15 December 2010	4 December 2010
Place in performance rating	not rated	2608
Series	AMD Turion II Neo	Legacy Intel® Core™ Processors
Vertical segment	Laptop	Mobile
Launch price (MSRP)		$39
Price now		$38.95
Processor Number		i3-390M
Status		Discontinued
Value for money (0-100)		16.49
Performance
64 bit support
Front-side bus (FSB)	3200 MHz	2500 MHz
L2 cache	1 MB	512 KB
Manufacturing process technology	45 nm	32 nm
Maximum frequency	1.6 GHz	2.66 GHz
Number of cores	2	2
Number of threads	2	4
Base frequency		2.66 GHz
Bus Speed		2.5 GT/s DMI
Die size		81 mm2
L1 cache		64 KB (per core)
L3 cache		3072 KB
Maximum core temperature		90°C for rPGA, 105°C for BGA
Transistor count		382 million
Compatibility
Sockets supported	S1	BGA1288, PGA988
Thermal Design Power (TDP)	15 Watt	35 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Package Size		rPGA 37.5mmx 37.5mm, BGA 34mmx28mm
Memory
Max memory channels		2
Maximum memory bandwidth		17.1 GB/s
Maximum memory size		8 GB
Supported memory types		DDR3 800/1066
Graphics
Graphics base frequency		500 MHz
Graphics max dynamic frequency		667 MHz
Graphics max frequency		667 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics		Intel HD Graphics
Graphics interfaces
Number of displays supported		2
Peripherals
Max number of PCIe lanes		16
PCI Express revision		2.0
PCIe configurations		1x16
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)		36-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)