Intel Atom x3-C3235RK vs Intel Celeron Dual-Core T3100

Comparative analysis of Intel Atom x3-C3235RK and Intel Celeron Dual-Core T3100 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Atom x3-C3235RK

Intel Celeron Dual-Core T3100

Differences

Reasons to consider the Intel Atom x3-C3235RK

2 more cores, run more applications at once: 4 vs 2
2 more threads: 4 vs 2
A newer manufacturing process allows for a more powerful, yet cooler running processor: 28 nm vs 45 nm

Number of cores	4 vs 2
Number of threads	4 vs 2
Manufacturing process technology	28 nm vs 45 nm

Reasons to consider the Intel Celeron Dual-Core T3100

Around 58% higher clock speed: 1.9 GHz vs 1.20 GHz

Maximum frequency	1.9 GHz vs 1.20 GHz

Compare benchmarks

CPU 1: Intel Atom x3-C3235RK
CPU 2: Intel Celeron Dual-Core T3100

Name	Intel Atom x3-C3235RK	Intel Celeron Dual-Core T3100
PassMark - Single thread mark		765
PassMark - CPU mark		1168
Geekbench 4 - Single Core		1108
Geekbench 4 - Multi-Core		1731

Compare specifications (specs)

	Intel Atom x3-C3235RK	Intel Celeron Dual-Core T3100
Essentials
Architecture codename	SoFIA 3G R	Penryn
Launch date	Q4'15	1 September 2009
Place in performance rating	not rated	2314
Processor Number	x3-C3235RK	T3100
Series	Intel® Atom™ Processor X Series	Legacy Intel® Celeron® Processor
Status	Launched	Discontinued
Vertical segment	Mobile	Mobile
Performance
64 bit support
Manufacturing process technology	28 nm	45 nm
Maximum frequency	1.20 GHz	1.9 GHz
Number of cores	4	2
Number of threads	4	2
Base frequency		1.90 GHz
Bus Speed		800 MHz FSB
Die size		107 mm2
Front-side bus (FSB)		800 MHz
L1 cache		128 KB
L2 cache		1024 KB
Maximum core temperature		105°C
Transistor count		410 million
VID voltage range		1.00V-1.250V
Memory
Max memory channels	1
Maximum memory bandwidth	4.2 GB/s
Maximum memory size	2 GB
Supported memory types	1x32 LPDDR2/3 1066 2x16 DDR3L 1333
Graphics
Graphics base frequency	600 MHz
Graphics interfaces
MIPI-DSI
Number of displays supported	1
Graphics image quality
Max resolution over eDP	up to 1920x1080
Graphics API support
OpenGL	ES 2.0
Compatibility
Low Halogen Options Available
Scenario Design Power (SDP)	2 W
Sockets supported	VF2BGA361	PGA478, BGA479
Package Size		35mm
Thermal Design Power (TDP)		35 Watt
Peripherals
Number of USB ports	1
UART
USB revision	2.0 OTG
Security & Reliability
Secure Boot
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
General-Purpose Input/Output (GPIO)
Enhanced Intel SpeedStep® technology
FSB parity
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)