Intel Celeron 2000E vs AMD A4-5150M

Comparative analysis of Intel Celeron 2000E and AMD A4-5150M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Celeron 2000E

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
  • Around 60% better performance in PassMark - Single thread mark: 1282 vs 800
  • 2.1x better performance in PassMark - CPU mark: 1607 vs 765
Specifications (specs)
Manufacturing process technology 22 nm vs 32 nm
Benchmarks
PassMark - Single thread mark 1282 vs 800
PassMark - CPU mark 1607 vs 765

Reasons to consider the AMD A4-5150M

  • Around 5% higher maximum core temperature: 105 °C vs 100°C
  • Around 6% lower typical power consumption: 35 Watt vs 37 Watt
Maximum core temperature 105 °C vs 100°C
Thermal Design Power (TDP) 35 Watt vs 37 Watt

Compare benchmarks

CPU 1: Intel Celeron 2000E
CPU 2: AMD A4-5150M

PassMark - Single thread mark
CPU 1
CPU 2
1282
800
PassMark - CPU mark
CPU 1
CPU 2
1607
765
Name Intel Celeron 2000E AMD A4-5150M
PassMark - Single thread mark 1282 800
PassMark - CPU mark 1607 765
Geekbench 4 - Single Core 1749
Geekbench 4 - Multi-Core 2416

Compare specifications (specs)

Intel Celeron 2000E AMD A4-5150M

Essentials

Architecture codename Haswell Richland
Launch date Q1'14 12 March 2013
Place in performance rating 1947 1925
Processor Number 2000E
Series Intel® Celeron® Processor 2000 Series AMD A-Series
Status Launched
Vertical segment Embedded Laptop

Performance

64 bit support
Base frequency 2.20 GHz
Bus Speed 5 GT/s DMI2
Manufacturing process technology 22 nm 32 nm
Maximum core temperature 100°C 105 °C
Number of cores 2 2
Number of threads 2 2
Die size 246 mm
L1 cache 96 KB
L2 cache 1 MB
Maximum case temperature (TCase) 105 °C
Maximum frequency 3.3 GHz
Transistor count 1300 Million

Memory

Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB
Supported memory types DDR3L 1333/1600 DDR3

Graphics

Graphics base frequency 400 MHz
Graphics max dynamic frequency 900 MHz
Intel® Flexible Display Interface (Intel® FDI)
Max video memory 1 GB
Processor graphics Intel HD Graphics

Graphics interfaces

DisplayPort
eDP
HDMI
Number of displays supported 3
VGA

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 32mm x 1.6mm
Sockets supported FCBGA1364 FS1r2
Thermal Design Power (TDP) 37 Watt 35 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 3.0
PCIe configurations 1x16 or 2x8 or 1x8 2x4
Scalability 1S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)