Intel Celeron 2000E vs AMD A4-5150M

Comparative analysis of Intel Celeron 2000E and AMD A4-5150M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Celeron 2000E

AMD A4-5150M

Differences

Reasons to consider the Intel Celeron 2000E

A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
Around 60% better performance in PassMark - Single thread mark: 1282 vs 800
2.1x better performance in PassMark - CPU mark: 1607 vs 765

Specifications (specs)
Manufacturing process technology	22 nm vs 32 nm
Benchmarks
PassMark - Single thread mark	1282 vs 800
PassMark - CPU mark	1607 vs 765

Reasons to consider the AMD A4-5150M

Around 5% higher maximum core temperature: 105 °C vs 100°C
Around 6% lower typical power consumption: 35 Watt vs 37 Watt

Maximum core temperature	105 °C vs 100°C
Thermal Design Power (TDP)	35 Watt vs 37 Watt

Compare benchmarks

CPU 1: Intel Celeron 2000E
CPU 2: AMD A4-5150M

PassMark - Single thread mark

CPU 1

CPU 2

1282

800

PassMark - CPU mark

CPU 1

CPU 2

1607

765

Name	Intel Celeron 2000E	AMD A4-5150M
PassMark - Single thread mark	1282	800
PassMark - CPU mark	1607	765
Geekbench 4 - Single Core		1749
Geekbench 4 - Multi-Core		2416

Compare specifications (specs)

	Intel Celeron 2000E	AMD A4-5150M
Essentials
Architecture codename	Haswell	Richland
Launch date	Q1'14	12 March 2013
Place in performance rating	1946	1925
Processor Number	2000E
Series	Intel® Celeron® Processor 2000 Series	AMD A-Series
Status	Launched
Vertical segment	Embedded	Laptop
Performance
64 bit support
Base frequency	2.20 GHz
Bus Speed	5 GT/s DMI2
Manufacturing process technology	22 nm	32 nm
Maximum core temperature	100°C	105 °C
Number of cores	2	2
Number of threads	2	2
Die size		246 mm
L1 cache		96 KB
L2 cache		1 MB
Maximum case temperature (TCase)		105 °C
Maximum frequency		3.3 GHz
Transistor count		1300 Million
Memory
Max memory channels	2
Maximum memory bandwidth	25.6 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3L 1333/1600	DDR3
Graphics
Graphics base frequency	400 MHz
Graphics max dynamic frequency	900 MHz
Intel® Flexible Display Interface (Intel® FDI)
Max video memory	1 GB
Processor graphics	Intel HD Graphics
Graphics interfaces
DisplayPort
eDP
HDMI
Number of displays supported	3
VGA
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 32mm x 1.6mm
Sockets supported	FCBGA1364	FS1r2
Thermal Design Power (TDP)	37 Watt	35 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	3.0
PCIe configurations	1x16 or 2x8 or 1x8 2x4
Scalability	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)