Intel Celeron 2000E vs AMD Phenom II X2 P650

Comparative analysis of Intel Celeron 2000E and AMD Phenom II X2 P650 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Celeron 2000E

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
  • Around 30% better performance in PassMark - Single thread mark: 1282 vs 985
  • Around 72% better performance in PassMark - CPU mark: 1607 vs 933
Specifications (specs)
Manufacturing process technology 22 nm vs 45 nm
Benchmarks
PassMark - Single thread mark 1282 vs 985
PassMark - CPU mark 1607 vs 933

Reasons to consider the AMD Phenom II X2 P650

  • Around 6% lower typical power consumption: 35 Watt vs 37 Watt
Thermal Design Power (TDP) 35 Watt vs 37 Watt

Compare benchmarks

CPU 1: Intel Celeron 2000E
CPU 2: AMD Phenom II X2 P650

PassMark - Single thread mark
CPU 1
CPU 2
1282
985
PassMark - CPU mark
CPU 1
CPU 2
1607
933
Name Intel Celeron 2000E AMD Phenom II X2 P650
PassMark - Single thread mark 1282 985
PassMark - CPU mark 1607 933
Geekbench 4 - Single Core 1527
Geekbench 4 - Multi-Core 2644

Compare specifications (specs)

Intel Celeron 2000E AMD Phenom II X2 P650

Essentials

Architecture codename Haswell Champlain
Launch date Q1'14 19 October 2010
Place in performance rating 1947 1914
Processor Number 2000E
Series Intel® Celeron® Processor 2000 Series AMD Phenom II Dual-Core Mobile Processors
Status Launched
Vertical segment Embedded Laptop
Family AMD Phenom
OPN Tray HMP650SGR23GM

Performance

64 bit support
Base frequency 2.20 GHz 2.6 GHz
Bus Speed 5 GT/s DMI2
Manufacturing process technology 22 nm 45 nm
Maximum core temperature 100°C 100°C
Number of cores 2 2
Number of threads 2 2
Front-side bus (FSB) 3600 MHz
L1 cache 256 KB
L2 cache 2 MB
Maximum frequency 2.8 GHz
Unlocked

Memory

Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB
Supported memory types DDR3L 1333/1600 DDR3

Graphics

Graphics base frequency 400 MHz
Graphics max dynamic frequency 900 MHz
Intel® Flexible Display Interface (Intel® FDI)
Max video memory 1 GB
Processor graphics Intel HD Graphics

Graphics interfaces

DisplayPort
eDP
HDMI
Number of displays supported 3
VGA

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 37.5mm x 32mm x 1.6mm
Sockets supported FCBGA1364 S1
Thermal Design Power (TDP) 37 Watt 35 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 3.0
PCIe configurations 1x16 or 2x8 or 1x8 2x4
Scalability 1S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
VirusProtect

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)