Intel Celeron G3900TE vs AMD Phenom II X2 N640

Comparative analysis of Intel Celeron G3900TE and AMD Phenom II X2 N640 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Celeron G3900TE

AMD Phenom II X2 N640

Differences

Reasons to consider the Intel Celeron G3900TE

A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
Around 35% better performance in PassMark - Single thread mark: 1402 vs 1039
Around 92% better performance in PassMark - CPU mark: 1850 vs 965

Specifications (specs)
Manufacturing process technology	14 nm vs 45 nm
Benchmarks
PassMark - Single thread mark	1402 vs 1039
PassMark - CPU mark	1850 vs 965

Compare benchmarks

CPU 1: Intel Celeron G3900TE
CPU 2: AMD Phenom II X2 N640

PassMark - Single thread mark

CPU 1

CPU 2

1402

1039

PassMark - CPU mark

CPU 1

CPU 2

1850

965

Name	Intel Celeron G3900TE	AMD Phenom II X2 N640
PassMark - Single thread mark	1402	1039
PassMark - CPU mark	1850	965
Geekbench 4 - Single Core		1705
Geekbench 4 - Multi-Core		2863

Compare specifications (specs)

	Intel Celeron G3900TE	AMD Phenom II X2 N640
Essentials
Architecture codename	Skylake	Champlain
Launch date	Q4'15	1 October 2010
Place in performance rating	1819	1779
Processor Number	G3900TE
Series	Intel® Celeron® Processor G Series	AMD Phenom II Dual-Core Mobile Processors
Status	Launched
Vertical segment	Embedded	Laptop
Family		AMD Phenom
OPN Tray		HMN640DCR23GM
Performance
64 bit support
Base frequency	2.30 GHz	2.8 GHz
Bus Speed	8 GT/s DMI3
Manufacturing process technology	14 nm	45 nm
Number of cores	2	2
Number of threads	2	2
Front-side bus (FSB)		3600 MHz
L1 cache		256 KB
L2 cache		2 MB
Maximum core temperature		100°C
Maximum frequency		2.9 GHz
Unlocked
Memory
Max memory channels	2
Maximum memory bandwidth	34.1 GB/s
Maximum memory size	64 GB
Supported memory types	DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V
Graphics
Device ID	0x1902
Graphics base frequency	350 MHz
Graphics max dynamic frequency	950 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory	64 GB
Processor graphics	Intel® HD Graphics 510
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3
Graphics image quality
4K resolution support
Max resolution over DisplayPort	4096x2304@60Hz
Max resolution over eDP	4096x2304@60Hz
Max resolution over HDMI 1.4	4096x2304@24Hz
Graphics API support
DirectX	12
OpenGL	4.4
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1151	S1
Thermal Design Power (TDP)	35 Watt	35 Watt
Thermal Solution	PCG 2015A (35W)
Peripherals
Max number of PCIe lanes	16
PCI Express revision	3.0
PCIe configurations	Up to 1x16, 2x8, 1x8+2x4
Scalability	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
VirusProtect
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)