Intel Celeron G470 vs AMD Sempron LE-1300

Comparative analysis of Intel Celeron G470 and AMD Sempron LE-1300 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Celeron G470

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
  • Around 29% lower typical power consumption: 35 Watt vs 45 Watt
  • Around 36% better performance in PassMark - Single thread mark: 837 vs 614
  • Around 37% better performance in PassMark - CPU mark: 570 vs 417
Specifications (specs)
Manufacturing process technology 32 nm vs 65 nm
Thermal Design Power (TDP) 35 Watt vs 45 Watt
Benchmarks
PassMark - Single thread mark 837 vs 614
PassMark - CPU mark 570 vs 417

Compare benchmarks

CPU 1: Intel Celeron G470
CPU 2: AMD Sempron LE-1300

PassMark - Single thread mark
CPU 1
CPU 2
837
614
PassMark - CPU mark
CPU 1
CPU 2
570
417
Name Intel Celeron G470 AMD Sempron LE-1300
PassMark - Single thread mark 837 614
PassMark - CPU mark 570 417
Geekbench 4 - Single Core 1056
Geekbench 4 - Multi-Core 1001

Compare specifications (specs)

Intel Celeron G470 AMD Sempron LE-1300

Essentials

Architecture codename Sandy Bridge Sparta
Launch date Q2'13 October 2007
Place in performance rating 2509 2506
Processor Number G470
Series Legacy Intel® Celeron® Processor
Status Launched
Vertical segment Desktop Desktop
Launch price (MSRP) $12
Price now $20
Value for money (0-100) 8.92

Performance

64 bit support
Base frequency 2.00 GHz
Bus Speed 5 GT/s DMI
Manufacturing process technology 32 nm 65 nm
Maximum core temperature 65.5°C
Number of cores 1 1
Number of threads 2
L1 cache 128 KB
L2 cache 512 KB
Maximum frequency 2.3 GHz

Memory

Max memory channels 2
Maximum memory bandwidth 17 GB/s
Maximum memory size 32 GB
Supported memory types DDR3 1066/1333

Graphics

Graphics base frequency 650 MHz
Graphics max dynamic frequency 1.00 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Graphics interfaces

Number of displays supported 2

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm
Sockets supported FCLGA1155 AM2
Thermal Design Power (TDP) 35 Watt 45 Watt

Peripherals

PCI Express revision 2.0

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)