Intel Celeron M 575 vs Intel Pentium D 830

Comparative analysis of Intel Celeron M 575 and Intel Pentium D 830 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Celeron M 575

Intel Pentium D 830

Differences

Reasons to consider the Intel Celeron M 575

CPU is newer: launch date 3 year(s) 1 month(s) later
Around 43% higher maximum core temperature: 100°C vs 69.8°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
4.2x lower typical power consumption: 31 Watt vs 130 Watt

Launch date	1 June 2008 vs May 2005
Maximum core temperature	100°C vs 69.8°C
Manufacturing process technology	65 nm vs 90 nm
Thermal Design Power (TDP)	31 Watt vs 130 Watt

Reasons to consider the Intel Pentium D 830

1 more cores, run more applications at once: 2 vs 1
Around 50% higher clock speed: 3 GHz vs 2 GHz
2x more L2 cache, more data can be stored in the L2 cache for quick access later

Number of cores	2 vs 1
Maximum frequency	3 GHz vs 2 GHz
L2 cache	2048 KB vs 1 MB

Compare benchmarks

CPU 1: Intel Celeron M 575
CPU 2: Intel Pentium D 830

Name	Intel Celeron M 575	Intel Pentium D 830
PassMark - Single thread mark		574
PassMark - CPU mark		564
Geekbench 4 - Single Core		198
Geekbench 4 - Multi-Core		341

Compare specifications (specs)

	Intel Celeron M 575	Intel Pentium D 830
Essentials
Architecture codename	Merom	Smithfield
Launch date	1 June 2008	May 2005
Launch price (MSRP)	$86
Place in performance rating	not rated	3159
Processor Number	575	830
Series	Legacy Intel® Celeron® Processor	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Mobile	Desktop
Performance
64 bit support
Base frequency	2.00 GHz	3.00 GHz
Bus Speed	667 MHz FSB	800 MHz FSB
Die size	143 mm2	206 mm2
Front-side bus (FSB)	667 MHz
L2 cache	1 MB	2048 KB
Manufacturing process technology	65 nm	90 nm
Maximum core temperature	100°C	69.8°C
Maximum frequency	2 GHz	3 GHz
Number of cores	1	2
Number of threads	1
Transistor count	291 million	230 million
VID voltage range	0.95-1.30V	1.200V-1.400V
L1 cache		28 KB
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm	37.5mm x 37.5mm
Sockets supported	PPGA478	PLGA775
Thermal Design Power (TDP)	31 Watt	130 Watt
Max number of CPUs in a configuration		2
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® AES New Instructions
Physical Address Extensions (PAE)		32-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Memory
Supported memory types		DDR1, DDR2, DDR3