Intel Celeron M 722 vs Intel Core 2 Duo T5270

Comparative analysis of Intel Celeron M 722 and Intel Core 2 Duo T5270 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Celeron M 722

Intel Core 2 Duo T5270

Differences

Reasons to consider the Intel Celeron M 722

Around 5% higher maximum core temperature: 105°C vs 100°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
5.8x lower typical power consumption: 5.5 Watt vs 35 Watt

Maximum core temperature	105°C vs 100°C
Manufacturing process technology	45 nm vs 65 nm
Thermal Design Power (TDP)	5.5 Watt vs 35 Watt

Reasons to consider the Intel Core 2 Duo T5270

1 more cores, run more applications at once: 2 vs 1
1 more threads: 2 vs 1
Around 17% higher clock speed: 1.4 GHz vs 1.2 GHz
2x more L2 cache, more data can be stored in the L2 cache for quick access later

Number of cores	2 vs 1
Number of threads	2 vs 1
Maximum frequency	1.4 GHz vs 1.2 GHz
L2 cache	2048 KB vs 1024 KB

Compare benchmarks

CPU 1: Intel Celeron M 722
CPU 2: Intel Core 2 Duo T5270

Name	Intel Celeron M 722	Intel Core 2 Duo T5270
PassMark - Single thread mark		535
PassMark - CPU mark		427
Geekbench 4 - Single Core		871
Geekbench 4 - Multi-Core		1215

Compare specifications (specs)

	Intel Celeron M 722	Intel Core 2 Duo T5270
Essentials
Architecture codename	Penryn	Merom
Launch date	1 October 2008	1 October 2008
Place in performance rating	not rated	2674
Processor Number	722	T5270
Series	Legacy Intel® Celeron® Processor	Legacy Intel® Core™ Processors
Status	Discontinued	Discontinued
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	1.20 GHz	1.40 GHz
Bus Speed	800 MHz FSB	800 MHz FSB
Die size	107 mm2	143 mm2
Front-side bus (FSB)	800 MHz	800 MHz
L1 cache	64 KB
L2 cache	1024 KB	2048 KB
Manufacturing process technology	45 nm	65 nm
Maximum core temperature	105°C	100°C
Maximum frequency	1.2 GHz	1.4 GHz
Number of cores	1	2
Number of threads	1	2
Transistor count	410 million	291 million
VID voltage range	0.775V - 1.1V	1.075V-1.250V
Compatibility
Low Halogen Options Available
Package Size	22mm x 22mm	35mm x 35mm
Sockets supported	BGA956	PPGA478
Thermal Design Power (TDP)	5.5 Watt	35 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)