Intel Celeron M 722 vs Intel Core 2 Duo T5800
Comparative analysis of Intel Celeron M 722 and Intel Core 2 Duo T5800 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron M 722
- Around 24% higher maximum core temperature: 105°C vs 85°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 5.8x lower typical power consumption: 5.5 Watt vs 35 Watt
Maximum core temperature | 105°C vs 85°C |
Manufacturing process technology | 45 nm vs 65 nm |
Thermal Design Power (TDP) | 5.5 Watt vs 35 Watt |
Reasons to consider the Intel Core 2 Duo T5800
- 1 more cores, run more applications at once: 2 vs 1
- 1 more threads: 2 vs 1
- Around 67% higher clock speed: 2 GHz vs 1.2 GHz
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Number of cores | 2 vs 1 |
Number of threads | 2 vs 1 |
Maximum frequency | 2 GHz vs 1.2 GHz |
L2 cache | 2048 KB vs 1024 KB |
Compare benchmarks
CPU 1: Intel Celeron M 722
CPU 2: Intel Core 2 Duo T5800
Name | Intel Celeron M 722 | Intel Core 2 Duo T5800 |
---|---|---|
PassMark - Single thread mark | 725 | |
PassMark - CPU mark | 628 | |
Geekbench 4 - Single Core | 238 | |
Geekbench 4 - Multi-Core | 410 |
Compare specifications (specs)
Intel Celeron M 722 | Intel Core 2 Duo T5800 | |
---|---|---|
Essentials |
||
Architecture codename | Penryn | Merom |
Launch date | 1 October 2008 | 1 October 2008 |
Place in performance rating | not rated | 3009 |
Processor Number | 722 | T5800 |
Series | Legacy Intel® Celeron® Processor | Legacy Intel® Core™ Processors |
Status | Discontinued | Discontinued |
Vertical segment | Mobile | Mobile |
Performance |
||
64 bit support | ||
Base frequency | 1.20 GHz | 2.00 GHz |
Bus Speed | 800 MHz FSB | 800 MHz FSB |
Die size | 107 mm2 | 143 mm2 |
Front-side bus (FSB) | 800 MHz | 800 MHz |
L1 cache | 64 KB | |
L2 cache | 1024 KB | 2048 KB |
Manufacturing process technology | 45 nm | 65 nm |
Maximum core temperature | 105°C | 85°C |
Maximum frequency | 1.2 GHz | 2 GHz |
Number of cores | 1 | 2 |
Number of threads | 1 | 2 |
Transistor count | 410 million | 291 million |
VID voltage range | 0.775V - 1.1V | 1.075V-1.175V |
Compatibility |
||
Low Halogen Options Available | ||
Package Size | 22mm x 22mm | 35mm x 35mm |
Sockets supported | BGA956 | PPGA478 |
Thermal Design Power (TDP) | 5.5 Watt | 35 Watt |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® Active Management technology (AMT) | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) |